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curable composition

A curable composition, amine curing agent technology, applied in the direction of adhesive types, novolak epoxy resin adhesives, adhesives, etc., can solve the problem of excellent low temperature curing, reduced storage stability and adhesion and other problems, to achieve the effect of excellent storage stability and adhesion

Active Publication Date: 2022-04-29
SUNSTAR GIKEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The object of the present invention is to provide an epoxy resin curable composition that solves the problems of the conventional epoxy resin low temperature curable compositions for automobiles as described above, Does not reduce storage stability and adhesiveness, and has excellent low-temperature curability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~8 and comparative example 1~7

[0051] Use a kneader to knead according to the combinations shown in Table 1 and Table 2 below, then pass through the three-roll mill twice, and then use a kneader to defoam and stir to make an epoxy resin curable combination for adhesives. things.

[0052] [Table 1]

[0053] (parts by mass)

[0054]

[0055] [Table 2]

[0056] (parts by mass)

[0057]

[0058] (Note 1) Bisphenol A type epoxy resin commercially available from Mitsubishi Chemical Corporation under the trade name "jER828"

[0059] (Note 2) CTBN-modified epoxy resin: Mix Epicoat 828 manufactured by JER Co., Ltd. and Hycar (registered trademark) CTBN1300×8 manufactured by Noveon Corporation at a ratio of 1:1, and heat at 120°C for 3 hours under the action of a quaternary ammonium salt catalyst. Acrylonitrile-butadiene-modified epoxy resin obtained by reaction under certain conditions

[0060] (Note 3) Polypropylene glycol diglycidyl ether marketed under the trade name "ADEKA GLYCIROL ED-506" by ADEKA Co...

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Abstract

According to the present invention, an epoxy resin-based curable composition that can be used as a structural adhesive for automobiles is provided. In particular, the present invention provides an epoxy resin-based curable composition that is excellent in low-temperature curability without reducing storage stability and adhesiveness. The present invention relates to a curable composition characterized by containing an epoxy resin, a urea curing accelerator (A) and an amine curing agent (B) having a pyrazine ring.

Description

technical field [0001] The present invention relates to an epoxy resin-based curable composition having excellent low-temperature curability without lowering storage stability and adhesiveness. Background technique [0002] Structural adhesives for automobiles use one-component heat-curable adhesives such as epoxy resins, which are cured simultaneously with sintering of electrodeposition coating in automobile production lines. Conventionally, this sintering temperature is about 30 minutes at 160 to 180°C. However, from the standpoint of considering the global environment and reducing manufacturing costs, it is required to lower the sintering temperature and shorten the sintering time. In addition, since the number of adhesives used in the structure of automobiles has increased, in the overlapping parts of the automobile chassis and steel plates, There is a situation in which sufficient curability cannot be ensured by existing adhesives, and the demand for adhesives curable ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/56
CPCC08G59/5073C08G59/4021C09J163/00C08G59/686C08G59/245C09J163/04
Inventor 高见和伸西田贵富
Owner SUNSTAR GIKEN KK