3results about How to "High curing reactivity" patented technology

The application belongs to the technical field of high-temperature-resistant resin materials, and discloses a nitrogen-containing heterocyclic monoaromatic nitrile monomer, a thermosetting resin and a preparation method thereof, wherein a bisphenol compound and a nitrogen-containing heterocyclic compound are reacted to obtain the nitrogen-containing heterocyclic monoaromatic nitrile monomer. The thermosetting resin is obtained by heating and curing a blend of the nitrogen-containing heterocyclic monoaromatic nitrile monomer and a curing agent. The prepared thermosetting resin has excellent thermal stability and mechanical properties.

The invention belongs to the technical field of resin materials, and particularly relates to alkaline phenolic resin as well as a preparation method and application thereof. The preparation method comprises the following steps: mixing phenol, bisphenol A and a solvent, adding an alkali liquor A and an alkali liquor B, carrying out a first reaction, adding formaldehyde, carrying out a second reaction, adding the alkali liquor A and the alkali liquor B, and carrying out a third reaction to obtain a product a; adding formaldehyde into the product a, carrying out a fourth reaction, adding alkali liquor A and alkali liquor B, carrying out a fifth reaction, adding formaldehyde, carrying out a sixth reaction, adding alkali liquor A and alkali liquor B, and carrying out a seventh reaction to obtain a product b; adding alkali liquor A into the product b, reacting for the eighth time, cooling, adding urea for reacting for the ninth time, adding an alcohol polymer and a silane coupling agent, and mixing to obtain alkaline phenolic resin; the alkali liquor A and the alkali liquor B respectively and independently represent a potassium hydroxide solution or a sodium hydroxide solution. The tensile strength of the alkaline phenolic resin prepared by the preparation method is 1.29-1.36 MPa.

This invention discloses a UV-curable solvent-free hot-press adhesive and its preparation method, belonging to the field of polymer materials. The UV-curable solvent-free hot-press adhesive contains 9 components by weight, including 5-10 parts of liquid polybutadiene and 10-20 parts of polyurethane acrylate oligomer. In the preparation process, some raw materials are first mixed, ester-soluble TPU is added for dissolution, a photoinitiator is added in the dark, and end-capping isocyanate is added after cooling. The application requires three steps: coating, UV curing (wavelength 365-405nm, light intensity 150mJ / cm²), and hot-pressing (120-140℃). Compared with traditional hot-press adhesives, it has no VOC emissions, high production efficiency, low energy consumption, and excellent adhesion performance (peel force 17.3-33.5N / 25mm).