2results about How to "High curing reactivity" patented technology

The application belongs to the technical field of high-temperature-resistant resin materials, and discloses a nitrogen-containing heterocyclic monoaromatic nitrile monomer, a thermosetting resin and a preparation method thereof, wherein a bisphenol compound and a nitrogen-containing heterocyclic compound are reacted to obtain the nitrogen-containing heterocyclic monoaromatic nitrile monomer. The thermosetting resin is obtained by heating and curing a blend of the nitrogen-containing heterocyclic monoaromatic nitrile monomer and a curing agent. The prepared thermosetting resin has excellent thermal stability and mechanical properties.

This invention discloses a UV-curable solvent-free hot-press adhesive and its preparation method, belonging to the field of polymer materials. The UV-curable solvent-free hot-press adhesive contains 9 components by weight, including 5-10 parts of liquid polybutadiene and 10-20 parts of polyurethane acrylate oligomer. In the preparation process, some raw materials are first mixed, ester-soluble TPU is added for dissolution, a photoinitiator is added in the dark, and end-capping isocyanate is added after cooling. The application requires three steps: coating, UV curing (wavelength 365-405nm, light intensity 150mJ / cm²), and hot-pressing (120-140℃). Compared with traditional hot-press adhesives, it has no VOC emissions, high production efficiency, low energy consumption, and excellent adhesion performance (peel force 17.3-33.5N / 25mm).