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Solvent-free 180-DEG C-resistant ultralow-viscosity epoxy resin matrix and preparation method thereof

An epoxy resin matrix and epoxy resin technology, which is applied in the field of solvent-free temperature-resistant 180°C ultra-low viscosity epoxy resin matrix and its preparation field, can solve the problems of high hygroscopicity, short pot life of low viscosity and high curing temperature

Pending Publication Date: 2020-10-20
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a solvent-free temperature-resistant 180°C Ultra-low Viscosity Epoxy Resin Matrix and Its Preparation Method

Method used

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  • Solvent-free 180-DEG C-resistant ultralow-viscosity epoxy resin matrix and preparation method thereof
  • Solvent-free 180-DEG C-resistant ultralow-viscosity epoxy resin matrix and preparation method thereof
  • Solvent-free 180-DEG C-resistant ultralow-viscosity epoxy resin matrix and preparation method thereof

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specific Embodiment approach 1

[0014] Specific implementation mode 1: In this implementation mode, a solvent-free temperature-resistant 180°C ultra-low viscosity epoxy resin matrix is ​​composed as follows in parts by mass: 30-80 parts of difunctional epoxy resin, 5-45 parts of multifunctional epoxy resin And 20.5 to 35 parts of liquid curing system.

[0015] This embodiment has the following advantages: (1) The epoxy resin matrix of this embodiment is suitable for the RTM molding process, and the resin has a relatively low viscosity (≤800mPa·s) at 50°C and has a long pot life (50°C, ≥300min); (2) Long storage period at room temperature, ≥15 days at 23°C; (3) Resin viscosity is low, no need to use defoamer; (4) Resin cures below 150°C , glass transition temperature ≥ 180 ℃, can be used for a long time at 150 ℃, and has good moisture resistance and excellent mechanical properties (moisture absorption rate is less than 1%, tensile strength ≥ 70MPa, elongation at break ≥ 3%).

specific Embodiment approach 2

[0016] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the difunctional epoxy resin is a glycidyl ether type epoxy resin, and its chemical structural formula is:

[0017]

[0018] where R 1 for -CH 2- or -C 3 h 6 -, R 2 -H, -CH 3 or -C 2 h 5 , m is 0, 1, 2, 3 or 4. Others are the same as the first embodiment.

specific Embodiment approach 3

[0019] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: glycidyl ether type epoxy resin is hydrogenated bisphenol A type epoxy resin DER383, bisphenol F type epoxy resin DER354, glycidyl ester type One or a combination of diglycidyl phthalate, diglycidyl isophthalate and diglycidyl terephthalate. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention relates to a solvent-free type 180 DEG C-resistant ultralow-viscosity epoxy resin matrix and a preparation method thereof, and aims to solve the problems of short low-viscosity working life, low use temperature, high curing temperature and high hygroscopicity of most existing epoxy resin matrixes for RTMs. The epoxy resin matrix consists of a bifunctional epoxy resin, a polyfunctional epoxy resin and a liquid-state curing system. The preparation method of the epoxy resin matrix comprises the following steps: stirring components at a high speed, fully and uniformly mixing, and defoaming in vacuum to obtain the epoxy resin matrix. According to the invention, the preparation process is simple and convenient, the epoxy resin matrix is low in viscosity, environmentally friendly and long in process window time, and the glass transition temperature (Tg) of the matrix after medium-temperature (150 DEG C) curing is higher than 180 DEG C; and the resin matrix is applied to the technical field of polymer composite materials.

Description

technical field [0001] The invention relates to a solvent-free epoxy resin matrix with a temperature resistance of 180°C and an ultra-low viscosity and a preparation method thereof. Background technique [0002] The RTM process is to inject a low-viscosity liquid resin into a mold cavity covered with a preform (reinforcement material) at a certain temperature and pressure, impregnate the fiber, solidify and mold, and then demould. This process is currently the composite molding process with the best comprehensive indicators. It has the characteristics of small tolerances, high surface quality, short production cycle, and high molding efficiency. It is a common molding process for large-scale composite materials and can be manufactured at low cost. play a huge role in. The Japan Reinforced Plastics Association listed the RTM process as the most promising composite molding process, and the US NASA included the RTM process in the Advanced Composite Materials Program. [0003]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50C08G59/68C08G59/38C08L63/00
CPCC08G59/5033C08G59/5026C08G59/68C08G59/687C08G59/38C08L63/00C08L2205/025C08L2205/035
Inventor 高堂铃王冠付刚邵南何影翠吴健伟匡弘
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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