Heat-resistant substrate resin and preparation method thereof

A matrix resin and heat-resistant technology, which is applied in the field of matrix resin for high-temperature-resistant composite materials and its preparation, can solve the problems of poor curing reactivity, difficult molding and processing of PN resin, and restrictions on wide application.

Inactive Publication Date: 2008-02-20
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the outstanding disadvantage of the resin is that the curing reactivity is poor, and the differential scanning calorimetry (DSC) analysis results show that the resin curing reaction initiation temperature (T onset ) is close to 200°C, and the curing peak temperature (T peak ) up to 264°C, these characteristics bring new difficulties to the molding and processing of PN resin, which limits its wide application

Method used

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  • Heat-resistant substrate resin and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1, preparation PN-APMI-4-1 resin

[0017] Get PN resin (the number-average molecular weight is 750, and the degree of propargylation is 115%) 60g is added into a 250ml three-necked flask, and a mechanical stirrer, a reflux condenser and a thermometer are installed. Use an oil bath to heat, and heat up while stirring until the temperature of the system rises to 120°C. Weigh 15g of APMI monomer, quickly add it to the flask, increase the stirring force, keep heating, keep stirring for 30min after the resin system becomes transparent, and discharge, finally get 70g of PN-APMI-4-1 resin.

[0018] The gel time of resin PN-APMI-4-1 at 170°C was measured on a self-made flat plate round hole gel time meter by wire drawing method, and the results are shown in Table 1. The test results show that compared with PN resin, the gel time is shortened from 140min to 31.6min, and the curing reactivity of the resin is greatly improved.

[0019] The thermosetting properties of ...

Embodiment 2

[0021] Embodiment 2, preparation PN-APMI-2-1 resin

[0022] Get 40g of PN resin (the number average molecular weight is 750, and the degree of propargylation is 115%) and add it into a 250ml three-necked flask, and install a mechanical stirrer, a reflux condenser and a thermometer. Use an oil bath to heat, and heat up while stirring until the temperature of the system rises to 120°C. Weigh 20g of APMI monomer, quickly add it to the flask, increase the stirring force, keep heating, keep stirring for 32min after the resin system becomes transparent, and discharge, finally get 56g of PN-APMI-2-1 resin.

[0023] The gel time of the resin PN-APMI-2-1 at 170°C was measured by the wire drawing method on a self-made flat plate round hole gel time tester. The results are shown in Table 1, indicating that the gel time was shortened to 18.8min. The curing reactivity of the resin is greatly improved.

[0024] The thermosetting properties of the resins were characterized by DSC. The tes...

Embodiment 3

[0026] Embodiment 3, preparation PN-APMI-1-1 resin

[0027] Get 40g of PN resin (the number average molecular weight is 750, and the degree of propargylation is 115%) and add it into a 250ml three-necked flask, and install a mechanical stirrer, a reflux condenser and a thermometer. Use an oil bath to heat, and heat up while stirring until the temperature of the system rises to 130°C. Weigh 40g of APMI monomer, quickly add it to the flask, increase the stirring force, keep heating, keep stirring for 28min after the resin system becomes transparent, and discharge, finally get 76g of PN-APMI-1-1 resin.

[0028]The gel time of the resin PN-APMI-1-1 at 170°C was measured by the wire drawing method on a self-made flat plate round hole gel time tester. The results are shown in Table 1, indicating that the gel time was shortened to 8.7min. The curing reactivity of the resin is greatly improved.

[0029] The thermosetting properties of the resins were characterized by DSC. The test ...

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Abstract

The invention discloses a heat-resisting matrix resin and the preparation method thereof. The heat-resisting matrix resin provided by the invention is prepared after the reaction of PN resin in formula I structure and APMI monomer in formula II structure. The PN resin and the APMI monomer of the invention are characterized in that the PN resin is modified with the APMI monomer to develop a matrix resin (PN-APMI) with good heat resistance and manufacturability used in high temperature resistant compound materials. The PN-APMI resin system of the invention is proved based on a test result to have good solidifying reactivity and excellent heat resistance, simple preparation, easy operation and low cost, thereby being applicable to mass popularization and application.

Description

technical field [0001] The invention relates to a matrix resin for high temperature resistant composite materials and a preparation method thereof. Background technique [0002] Resin-based composite materials have the advantages of light weight, high specific strength and specific stiffness, strong designability, and easy to form large-area structural parts, so they are widely used in construction, transportation, and shipbuilding. and is considered an important symbol of technological progress in aerospace materials. However, with the development of aerospace and space technology, this field has put forward higher requirements for the high temperature resistance of composite materials, so the development of matrix resins with excellent high temperature resistance and excellent processability has become a new research hotspot. [0003] Bismaleimide (BMI for short) is a kind of heat-resistant matrix resin derived from polyimide, which is a bifunctional compound with maleimi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/30
Inventor 赵彤罗振华王明存魏柳荷
Owner INST OF CHEM CHINESE ACAD OF SCI
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