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Radiation child-mother plate cured colloid and child plate forming method thereof

A molding method, a technology of sub-master, applied in the directions of adhesive, printing plate preparation, epoxy resin glue, etc., can solve the problems of low bonding strength, deviation of quality stability, weakened adhesion, etc., to improve cross-linking Density, good construction performance, the effect of improving adhesion

Pending Publication Date: 2020-05-19
CHUZHOU JINQIAO TEXAS NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, hot melt adhesives are widely used, but it also has some disadvantages: insufficient heat resistance, low bonding strength, poor chemical resistance, long curing time, a small amount of VOC release, and is not environmentally friendly; special equipment such as heat Melting guns are used to melt and sizing, which is inconvenient to use, etc.
[0003] Traditional UV-curable coating materials have the following disadvantages: 1. Photoinitiators need to be used, and small molecule photoinitiators have migration risks; 2. UV-curing requires a certain period of time to irradiate the coating to ensure that the coating is completely cured, and the efficiency is low
3. The UV lamp ages faster over time, and the curing power gradually decreases, so its quality stability deviates
4. UV curable coating has poor UV resistance and aging resistance
However, in actual production, it will be found that the high-definition of the product leads to a smaller design of the graphic size, a smaller contact area between the colloid and the substrate or the transfer roller, weakened adhesion, and prone to poor glue loss; in addition, the existing colloid components and The materials of the transfer rollers are quite different, resulting in a large difference in the adhesion between them, which will cause various problems such as glue dropping, over-display, drilling, adhesion, and difficulty in cleaning, which makes the application process very difficult. not practical

Method used

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  • Radiation child-mother plate cured colloid and child plate forming method thereof
  • Radiation child-mother plate cured colloid and child plate forming method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] The molding method of the radiant master-cured colloidal sub-board includes the following steps:

[0046] (1) Laser engraving the required pattern on a metal roller with high surface finish, so that the surface of the roller is formed with a pattern texture for subsequent transfer to obtain a master; the surface of the metal roller has a metal chromium plating layer with a thickness of 30μm, The surface finish of the metal roller is above level 12, the depth of the pattern texture on the master plate is 5-20μm, and the ratio of the width to the depth of a single microscopic three-dimensional texture is controlled at 2~4:1.

[0047] (2) Coat the radiation master-cured colloid on the release paper to form a transfer adhesive layer with a thickness of 60μm. The transfer adhesive layer is initially dried under negative pressure, and then the heating plate is used on the release paper. The back 0.5mm is baked at 80~90℃ for 1min, and the peeling strength between the release paper ...

Embodiment 2

[0061] Refer to the molding method of the radiation master-cured colloidal sub-board in Example 1; wherein in step (1), the thickness of the metal chromium-plated layer on the surface of the metal roller is 40 μm, and the depth of the pattern texture on the master is 10-25 μm; step ( 2), the thickness of the transfer adhesive layer formed is 80μm, adjust the baking time of the heating plate to control the peeling strength between the release paper and the transfer adhesive layer is 2.5 times the peel strength between the transfer adhesive layer and the master , The pressure on the transfer adhesive layer during the pressing process is 300kPa, and the others are the same as in Example 1.

[0062] The radiation master-curing colloid used includes the following components by weight: 56 parts of polyurethane modified acrylic resin; 42 parts of walnut meal modified melamine urea-formaldehyde resin; 24 parts of bisphenol A epoxy resin; tannic acid as the core 15 parts of arm-type photo...

Embodiment 3

[0073] The molding method of the radiant master-cured colloidal sub-board is the same as that of Example 1.

[0074] The radiation master-curing colloid includes the following components by weight: 60 parts of polyurethane modified acrylic resin; 38 parts of walnut meal modified melamine urea-formaldehyde resin; 28 parts of bisphenol A epoxy resin; multi-arm type with tannic acid as the core 15 parts of photosensitive resin; 16 parts of fluorine-containing acrylic resin; 30 parts of active diluent; 7.8 parts of adhesion promoter; 1.4 parts of silane coupling agent; 1.2 parts of nano particles; 0.48 parts of auxiliary agent.

[0075] The bisphenol A epoxy resin is bisphenol A epoxy resin E44 and bisphenol A epoxy resin E51, and the mass ratio is 2:1.

[0076] Fluorine-containing acrylic resin fluorocarbon acrylate block copolymer and fluorocarbon acrylate multi-arm star-block copolymer, the mass ratio is 1:1.

[0077] The active diluent is trimethylolpropane triacrylate and tripropylen...

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Abstract

The invention relates to a radiation child-mother plate cured colloid and a child plate forming method thereof. The child plate forming method comprises the steps that (1) carving a needed pattern ona metal roller with a metal chrome plating layer and high surface smoothness through lasers, and forming pattern textures used for follow-up transfer printing on the surface of the roller so as to obtain a mother plate; (2) coating the radiation child-mother plate cured colloid on a base material; forming a transfer printing adhesive layer, drying and baking the transfer printing adhesive layer under reduced pressure, controlling the peel strength between the base material and the transfer printing adhesive layer to be more than two times of the peel strength between the transfer printing adhesive layer and the mother plate, pressing the transfer printing adhesive layer by adopting the mother plate, and transferring pattern textures on the mother plate onto the adhesive layer; and (3) carrying out electron beam irradiation on the transfer printing adhesive layer coated on the base material and printed with the pattern texture to cure the transfer printing adhesive layer to obtain the child plate convenient to strip. The radiation child-mother plate cured colloid obtained by the method can well keep the uneven feeling corresponding to the concave-convex shape of the required pattern, is good in impressing, has no defects in a line / space, can achieve excellent gloss and high-quality feeling in appearance, and can meet the sticker requirements of various high-grade articles.

Description

Technical field [0001] The invention belongs to the technical field of electron beam curing transfer glue, and specifically relates to a forming method for transferring the texture of a master plate to a daughter plate by using electron beam curing. Background technique [0002] The glue layer adhesive used in the transfer film industry is mainly hot melt adhesive. The hot melt adhesive is solid at room temperature, and can be applied by heating and melting and bonding can be completed after pressing. At present, hot melt adhesives are widely used, but it also has some shortcomings: insufficient heat resistance, low bonding strength, poor chemical resistance, long curing time, a small amount of VOC release, and not environmentally friendly; it requires special equipment such as heat It is inconvenient to use a melting gun to melt and apply glue. [0003] Traditional UV-curable coating materials have the following disadvantages: 1. Photoinitiators are required, and small-molecule ...

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J161/32C09J163/00C09J133/16C09J11/06C09J11/04B41C1/00B23K26/362
CPCB23K26/362B41C1/00C08K2003/2241C08K2003/2296C08K2201/011C09J11/04C09J11/06C09J175/14C08L61/32C08L63/00C08L33/16C08K13/02C08K3/22C08K3/36C08K5/544
Inventor 王超
Owner CHUZHOU JINQIAO TEXAS NEW MATERIALS CO LTD
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