Semiconductor refrigeration device

Abstract

The invention relates to a semiconductor refrigeration device. The semiconductor refrigeration device comprises a box body; a flow guide component is arranged in box body; at least one set of semiconductor thermopile is arranged in the flow guide component; an outer air inlet is formed in the upper side of the left end of the box body; an outer air outlet is formed in the lower side of the left end of the box body; an inner air inlet is formed in the upper side of the right end of the box body; an inner air outlet is formed in the lower side of the right end of the box body; the outer air inlet is communicated with the outer air outlet through the flow guide component, so that an outer circulation air duct can be formed; the inner air inlet is communicated with the inner air outlet throughthe flow guide component, so that an inner circulation air duct can be formed; the semiconductor thermopile comprises heat absorption areas and heat release areas which are distributed alternately; the outer circulation air duct passes through the heat release areas; and the inner circulation air duct passes through the heat absorption areas. According to the semiconductor refrigeration device ofthe invention, the outer circulation air duct and the inner circulation air duct are adopted; the semiconductor thermopile is provided with the heat absorption areas and the heat release areas whichare distributed alternately; the outer circulation air duct passes through the heat release areas; the inner circulation air duct passes through the heat absorption areas; and therefore, the cold endand hot end of the semiconductor thermopile do not exchange heat, the loss of cooling capacity is avoided, and refrigerating efficiency is good.

Description

technical field [0001] The invention belongs to the technical field of electronic refrigeration equipment, in particular to a semiconductor refrigeration device. Background technique [0002] At present, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for cooling is widely used, and semiconductor refrigeration chips include a cold end that releases cold energy and a hot end that releases heat. The cold end releases cold energy into the refrigeration compartment of the refrigeration equipment through the cold end radiator, while the hot end of the semiconductor cooling chip needs to dissipate heat to the outside through the hot end radiator. However, in the actual use of the hot end radiator, the heat dissipation capacity of the radiator directly affects the cooling capacity and cooling efficiency of the semiconductor. Since the cold end and the hot end of the semiconductor refrigeration chip are...

AI Technical Summary

Problems solved by technology

Since the cold end and the hot end of the semiconductor refrigeration chip are set opposite to each other, and the cold end radiator and the hot end radiator are adjacent to each other, the cold end and the hot end radiator are prone to heat exchange, resulting in the loss of cooling capacity, thus making the refrigeration equipment Less efficient cooling and increased energy consumption

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