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Electrolytic tin alloy plating solution

An electroplating tin and alloy technology, which is applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problem that solder balls are difficult to meet the miniaturization requirements of semiconductor chips, and achieve the effect of suppressing the generation of voids

Inactive Publication Date: 2020-04-24
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although solder balls and the like are used as connection bumps, with the miniaturization of semiconductor chips, it is difficult for the solder balls in the prior art to meet the miniaturization requirements of semiconductor chips.

Method used

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  • Electrolytic tin alloy plating solution
  • Electrolytic tin alloy plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] As the oxide of the nitrogen-containing heterocyclic compound, pyridine-N-oxide was used at a concentration of 5 g / L. The flavonoid compound uses naringin, the concentration is 0.3g / L. Adding tin(II) alkanesulfonate as a supply source of tin ions makes Sn 2+ The concentration of the meter reaches 60g / L, adding silver alkane sulfonate as a supply source of silver ions, so that Ag + to a concentration of 0.5 g / L, methanesulfonic acid as an organic acid was added to a concentration of 70 g / L, and a nonionic surfactant was added to a concentration of 20 g / L. The bath temperature is 30°C and the current density is 4A / dm 2 .

[0049] In the case of either pad diameter, no voids were observed in the bumps composed of the resulting tin-silver alloy plating films after reflow.

Embodiment 2

[0051] Except that nicotinic acid-N-oxide was used as the oxide of the nitrogen-containing heterocyclic compound and the concentration was 1 g / L, other aspects were the same as in Example 1, and a tin-silver alloy coating was formed in this way. In the case of either pad diameter, no voids were observed in the bumps composed of the resulting tin-silver alloy plating films after reflow.

Embodiment 3

[0053] Except that the oxidation of the nitrogen-containing heterocyclic compound uses 3g / L of pyridine-N-oxide, and the flavonoid compound uses 5g / L of methyl hesperidin, other aspects are all the same as in Example 1, thus forming tin silver Alloy coating. In the case of either pad diameter, no voids were observed in the bumps composed of the resulting tin-silver alloy plating films after reflow.

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Abstract

The present invention provides an electrolytic tin alloy plating solution. The electrolytic tin alloy plating solution contains a compound serving as a source of supply of tin ions, a compound servingas a source of supply of silver ions, an oxide of a nitrogen-containing heterocyclic compound, and a flavonoid compound.

Description

technical field [0001] The invention relates to a plating solution for electroplating tin alloys, in particular to a plating solution for electroplating tin alloys that can be used to form bumps. Background technique [0002] Bumps for connection are provided on the semiconductor chip. Although solder balls are used as connection bumps, it is difficult for the solder balls in the prior art to meet the miniaturization requirements of semiconductor chips. There are microspheres with a diameter of about 100 μm, but bumps formed by electroplating tin (Sn) or tin alloys are attracting attention because further miniaturization of bumps is required (for example, refer to Patent Document 1). [0003] When forming micro-bumps by electroplating, it is required to uniformly deposit multiple independent plating films in the range of tens of microns with a thickness of tens of microns. Furthermore, it is required to form a plated film whose surface is as flat as possible and which is d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/60
CPCC25D3/60C23C18/54C25D3/32C25D3/38C25D3/46
Inventor 桥本大督榎本将人河原知博木曾雅之
Owner C UYEMURA & CO LTD
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