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A uniform and adjustable pressure semiconductor laser multi-die sintering fixture and sintering method

A sintering method and laser technology, used in semiconductor lasers, lasers, laser parts and other directions, can solve the problems of easy shaking of the pressure column, large size of the fixture, complex structure, etc., to ensure the accuracy of height difference, reasonable structure of the fixture, and improve sintering quality effect

Active Publication Date: 2020-11-27
Shandong Huaguang Optoelectronics Co. Ltd.
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that the COS is pressurized by feeding the screw. First, the lower end of the pressure column is easy to shake when the feed screw is turned, which affects the consistency of the alignment direction of the COS. Second, it is impossible to control the magnitude of the downward pressure. , affecting the consistency of the COS height
The disadvantage of this method is that the pressure acting on the main chip of the semiconductor laser cannot be adjusted, the main chip cannot be accurately positioned, and the clamp is large in size and complex in structure.

Method used

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  • A uniform and adjustable pressure semiconductor laser multi-die sintering fixture and sintering method
  • A uniform and adjustable pressure semiconductor laser multi-die sintering fixture and sintering method
  • A uniform and adjustable pressure semiconductor laser multi-die sintering fixture and sintering method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as figure 1 As shown, a semiconductor laser multi-die sintering fixture with uniform pressure and adjustable pressure includes a limit block 1 fixed on the laser shell 7, and the upper and lower surfaces of the limit block 1 are correspondingly provided with the same multiple steps, such as image 3 As shown, the laser package is provided with multiple steps, the multi-level steps of the limiting block 1 correspond to the multi-level steps of the laser package, and the height difference of the multi-level steps is preferably the same, and the limiting block 1 is provided with multiple Limit hole 5, each limit hole 5 is provided with a pressing block 3 matching it, the size of the limit hole 5 matches the size of the COS, put the COS through the upper end of the limit hole 5, and place it in the limit hole 5 No shaking inside, multiple limit holes 5 can limit the consistency of COS direction and position, and can also limit the pressure block 3, and elastic parts a...

Embodiment 2

[0039] A uniform and adjustable pressure semiconductor laser multi-die sintering fixture, the structure is as shown in Embodiment 1, the difference is that the same position on the plurality of compacts 3 are all provided with through holes 6, and the through holes 6 are interpolated Connecting rod 4 is connected, and the length of the connecting rod 4 protruding from the through hole 6 is the same. The elastic part is located between the two ends of the connecting rod 4 and the limit block 1, and is symmetrically distributed on both sides of the limit hole 5, which can ensure uniform pressure consistency.

Embodiment 3

[0041] A uniform and adjustable semiconductor laser multi-die sintering fixture, the structure is as shown in Embodiment 1, the difference is that the number of through holes 6 on the compact 3 is five, and vertically along the middle of the compact 3 The direction is evenly distributed, the elastic component is spring 2, the elastic coefficient of spring 2 is the same, one end of spring 2 is fixed on the step of limit block 1, and the other end is hung on one end of connecting rod 4 through a hanging ring;

[0042] The through hole 6 is a round hole, and the connecting rod 4 is a round bar. The round bar 4 is provided with threads, and after being inserted into the round hole, it is fixed with bolts.

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Abstract

The invention relates to a semiconductor laser multi-die sintering fixture with uniform and adjustable pressure and a sintering method and belongs to the technical field of semiconductor optoelectronics. The clamp comprises a limiting block fixed on a laser tube shell, wherein an upper surface and a lower surface of the limiting block are correspondingly provided with multiple steps the same as those of the laser tube shell, a plurality of limiting holes are formed in the limiting block, a pressing block matched with each limiting hole is arranged in each limiting hole, and an elastic component is arranged between each limiting block and the corresponding pressing block. The clamp is advantaged in that pressure is applied to the pressing block through stretching and retracting of the multiple elastic components, that the pressure is uniform and consistent by guaranteeing the same stretching and retracting amount is guaranteed, the pressure can be adjusted by adjusting the stretching and retracting amount of the elastic components, consistency and adjustability of the pressure are achieved, consistency of the solder thickness can be guaranteed, and a chip can be prevented from beingcrushed.

Description

technical field [0001] The invention relates to a uniform and adjustable pressure semiconductor laser multi-tube core sintering jig and a sintering method, belonging to the technical field of semiconductor optoelectronics. Background technique [0002] Due to the advantages of small size, light weight, high conversion efficiency, long life, and wide wavelength coverage, semiconductor lasers are widely used in industrial, medical, communication, and military fields, gradually replacing traditional gas and solid-state lasers. In recent years, with the development of industrial processing, medical treatment, laser printing and other fields, the demand for high-power semiconductor lasers is also increasing year by year. [0003] At present, due to the progress of semiconductor laser Chip on Submount (COS) material growth and manufacturing technology, the power of a single chip has reached nearly 20W, but it still cannot meet the needs of industrial production for high-power lase...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/022
CPCH01S5/0237
Inventor 刘成成开北超邵慧慧于果蕾徐现刚
Owner Shandong Huaguang Optoelectronics Co. Ltd.