Chip stack liquid cooling heat exchanger

Abstract

The invention discloses a sheet-type stacked liquid-cooled heat exchanger, which aims to provide a high-efficiency liquid-cooled heat exchanger with high cooling efficiency and capable of effectively suppressing the hot spot effect. The present invention is realized through the following technical scheme: at least four layers are formed on the liquid-cooled pooling layer, and subdivided flow channels and top sealing connecting pieces are adopted to be dislocated along round holes, rectangular strip holes, and square hole structures, and the heat exchange layer is located at Below the liquid-cooled collection layer, based on the mounting rectangular sheets with linear array holes on both sides of the middle rectangular hole, the first heat exchange patch corresponding to the mounting rectangular sheet linear array holes and the central rectangular hole is sequentially laminated, The second heat exchange patch, the third heat exchange patch, the fourth heat exchange patch heat exchange layer in the middle, the fifth heat exchange patch and the bottom closed heat exchange sheet are laminated as a heat exchange layer; Due to different requirements for power consumption and temperature control, adjust the number of main heat exchange layers in the stacked liquid-cooled plate integrated on the liquid-cooled substrate to achieve precise temperature control of cooling module-level electronic device chips on the same module.

Description

technical field [0001] The invention relates to a liquid-cooled cold plate suitable for thermal control of electronic chips and electronic equipment modules with high heat flux. Background technique [0002] In recent years, the rapid development of electronic information technology and microfabrication technology has provided the possibility for the research and application of micro heat exchange equipment. Thermal control technology is one of the key technologies in the structural design of electronic equipment, which is related to whether the entire electronic equipment system can work normally, work performance and reliability. Today, the development trend of electronic equipment is becoming more and more miniaturized, compact and integrated, and the feature size of its internal electronic components has reached the micron level. For example, the microprocessor code-named SandyBridge of Intel Corporation can already be in 261mm 2 With nearly 109 transistors integrated ...

AI Technical Summary

Problems solved by technology

[0008] Although liquid-cooled cold plates have been applied in the market in recent years, there are the following problems in common electronic equipment liquid-cooled cold plates: the inlet pipe and outlet of the liquid refrigerant of commonly used liquid-cooled cold plates are not located on the side of the cold plate Vertical installation is to install vertically on the vertical surface of the liquid-cooled cold plate. This interface method leads to easy concentration of stress at the interface of the liquid-cooled cold plate, which becomes a vulnerable part of the liquid-cooled system

Due to the different chip sizes, this leads to different heights of the bosses, which leads to different thermal resistances. At the same time, the heat consumption of the chips is not uniform, high or low, and the "hot spot" effect is very prominent, making it difficult to integrate all chips. The temperature is controlled within a small range, and on the same module, for chips with different temperature upper limits, the temperature control of the entire module can only be realized by controlling the chip with a lower temperature upper limit, resulting in a waste of thermal control resources

Therefore, the traditional liquid-cooled cold plate has the problem that the temperature of the chip is difficult to control independently, and the utilization rate of the thermal control resources of the cold plate is not high.

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