Sheet-type stacked liquid cooling heat exchanger

Abstract

The invention discloses a sheet-type stacked liquid cooling heat exchanger. According to the efficient liquid cooling heat exchanger, the cooling efficiency is high, and a hot spot effect can be effectively inhibited. According to the technical scheme, at least four layers of subdivision runners and a top sealing connecting sheet distributed in a staggered mode along a round hole structure, a rectangular strip hole structure and a square hole structure are manufactured on a liquid cooling collection layer; a heat exchange layer is located below the liquid cooling collection layer, and on the basis of surface-mounted rectangular sheets of linear array arrangement holes on the two side of the middle rectangular hole, a first heat exchange patch, a second heat exchange patch, a third heat exchange patch and a fourth heat exchange patch heat exchange layer in the middle, a heat exchange patch and a liquid cooling substrate which are corresponding to the linear array arrangement holes of the surface-mounted rectangular sheet and the central rectangular hole are laminated in sequence; and according to different heat consumption and temperature control requirements of corresponding chips,the number of the main heat exchange layers in the stacked liquid cooling plates 18 integrated on a substrate is adjusted, and accurate temperature control of cooling module-level electronic equipment chips on the same module is achieved.

Description

technical field [0001] The invention relates to a liquid-cooled cold plate suitable for thermal control of electronic chips and electronic equipment modules with high heat flux. Background technique [0002] In recent years, the rapid development of electronic information technology and microfabrication technology has provided the possibility for the research and application of micro heat exchange equipment. Thermal control technology is one of the key technologies in the structural design of electronic equipment, which is related to whether the entire electronic equipment system can work normally, work performance and reliability. Today, the development trend of electronic equipment is becoming more and more miniaturized, compact and integrated, and the feature size of its internal electronic components has reached the micron level. For example, the microprocessor code-named SandyBridge of Intel Corporation can already be in 261mm 2 With nearly 109 transistors integrated ...

AI Technical Summary

Problems solved by technology

[0008] Although liquid-cooled cold plates have been applied in the market in recent years, there are the following problems in common electronic equipment liquid-cooled cold plates: the inlet pipe and outlet of the liquid refrigerant of commonly used liquid-cooled cold plates are not located on the side of the cold plate Vertical installation is to install vertically on the vertical surface of the liquid-cooled cold plate. This interface method leads to easy concentration of stress at the interface of the liquid-cooled cold plate, which becomes a vulnerable part of the liquid-cooled system

Due to the different chip sizes, this leads to different heights of the bosses, which leads to different thermal resistances. At the same time, the heat consumption of the chips is not uniform, high or low, and the "hot spot" effect is very prominent, making it difficult to integrate all chips. The temperature is controlled within a small range, and on the same module, for chips with different temperature upper limits, the temperature control of the entire module can only be realized by controlling the chip with a lower temperature upper limit, resulting in a waste of thermal control resources

Therefore, the traditional liquid-cooled cold plate has the problem that the temperature of the chip is difficult to control independently, and the utilization rate of the thermal control resources of the cold plate is not high.

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