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Carrier plate glass and laminated structure for preparing flexible substrate

A stacked structure, flexible substrate technology, applied in the direction of climate sustainability, final product manufacturing, sustainable manufacturing/processing, etc., can solve problems such as product yield loss, and achieve the effect of improving yield

Pending Publication Date: 2020-05-26
INCOFLEX SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when using DPSSL release technology, it is especially necessary to reduce scratches and particles on the back of the carrier glass during the manufacturing process. This requires a very high degree of cleanliness on the surface of the carrier glass, otherwise the loss of product yield in subsequent manufacturing may be greatly increased.
At present, there is no improvement plan on how to reduce the scratches and particles on the back of the carrier glass in the DPSSL release process, so as to improve the yield of the DPSSL release process.

Method used

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  • Carrier plate glass and laminated structure for preparing flexible substrate
  • Carrier plate glass and laminated structure for preparing flexible substrate
  • Carrier plate glass and laminated structure for preparing flexible substrate

Examples

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Embodiment Construction

[0030] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms, and should not be construed as being limited to the examples set forth herein; on the contrary, the provision of these embodiments makes the present disclosure more comprehensive and complete, and fully conveys the concept of the example embodiments To those skilled in the art. The described features, structures or characteristics can be combined in one or more embodiments in any suitable way.

[0031] In addition, the drawings are only schematic illustrations of the present disclosure, and are not necessarily drawn to scale. The same reference numerals in the figures indicate the same or similar parts, and thus their repeated description will be omitted. Some of the block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entitie...

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Abstract

The invention relates to carrier plate glass and a laminated structure for preparing a flexible substrate. The carrier plate glass comprises a glass substrate and a protective material layer, whereinthe glass substrate comprises a first surface and a second surface which are opposite to each other, and the second surface is used for forming a release layer; and the protective material layer is arranged on the first surface of the glass substrate. According to the invention, scratches, attached particles and the like generated by the carrier plate glass in the manufacturing process of a flexible panel can be reduced, so that laser is enabled to be distributed in an effective area in the DPSSL release process, the yield of the DPSSL release process is improved, and the yield of the manufactured flexible panel is further improved.

Description

Technical field [0001] The present disclosure relates to the field of display technology, and in particular to a carrier glass and a laminated structure for preparing a flexible substrate. Background technique [0002] In recent years, the technology of flexible display devices has developed rapidly. Compared with traditional glass rigid display devices, flexible display devices have the advantages of impact resistance, strong shock resistance, light weight, small size, and wearability. Flexible display devices currently widely use flexible substrates, but the flexible substrates are too soft and pose a challenge to various film forming processes. Therefore, in the preparation process of the flexible substrate, a carrier glass with good surface flatness and rigidity is usually required. After the preparation of the flexible substrate is completed, the flexible substrate needs to be peeled off from the carrier glass. Therefore, the effective separation of the flexible substrate ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/00H01L21/673H10K99/00
CPCH01L21/673H10K71/80H10K77/111Y02E10/549Y02P70/50
Inventor 施文杰
Owner INCOFLEX SEMICON TECH CO LTD