Thin film preparation equipment and thin film preparation method

Abstract

The invention provides thin film preparation equipment and a thin film preparation method. A film coating chamber comprises n cathode targets arranged at intervals, n sputtering power supplies, a basearranged opposite to the cathode targets, partitioning devices for equally dividing a film coating area of each cathode target into n deposition areas, and a control device, wherein the control device calculates the sputtering power of the n cathode targets in m time periods according to film thickness data of n rows and m columns of units of a to-be-prepared thin film and deposition rate data ofthe n deposition areas of the n cathode targets, and controls the corresponding sputtering power supplies to have the corresponding sputtering power according to the calculation result, therefore, different units in the n rows and m columns of units of the to-be-prepared thin film have different film thicknesses, and the thin film with different n and m, namely different film thickness distributions, can be flexibly and efficiently prepared according to actual conditions.

Description

technical field [0001] The invention relates to the technical field of thin film manufacturing, and more specifically, relates to a thin film preparation device and a thin film preparation method. Background technique [0002] Thin film uniformity is an important indicator of thin film preparation equipment such as magnetron sputtering equipment, that is, it is required that the target atoms are evenly arranged on the surface of the substrate, so that the thickness of the film in each area of ​​the substrate is consistent. However, there are also special fields that require the preparation of non-uniform thin films, that is, the target atoms are required to be unevenly distributed on the surface of the substrate according to the designed film thickness, so as to achieve different effects or properties. For example, different film thickness distributions make the film show different colors, different film thickness distributions make the electrical properties of the film inco...

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Problems solved by technology

[0003] Although in the prior art, the preparation of non-uniform thin films can be realized by adding shielding plates or shielding strips in front of the sputtering target position and covering the mask on the surface of the substrate, when the film thickness of the prepared non-uniform thin films When the distribution changes, it is necessary to change the arrangement of the shading plates or shading strips, or to make a new mask, resulting in low work efficiency and poor flexibility of the film preparation equipment when preparing films with different film thickness distributions.

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