Automatic device and method for bundling metal filaments
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- DONGHUA UNIV
- Publication Date
- 2020-06-05
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Abstract
Description
technical field
[0001] The invention relates to an automatic device for bundling metal filaments and an automatic method for bundling metal filaments using the device, in particular to the manufacture of conductive bundle brushes in the technical field of rotary electrical connection. Background technique
[0002] In the field of rotating connections such as conductive slip rings, the conductive beam brush is one of the key components. The bundle brush is to gather several metal wires of the same length into a bundle, then insert one end into a metal round tube, and press the metal round tube with a certain force, so that one end of the wire bundle is fixed in the metal round tube. The diameter of the metal wire is a few tenths of a millimeter or less, and the length generally ranges from a few millimeters to tens of millimeters; the inner diameter of the metal tube is about 1mm, the wall thickness is about 0.2mm, and the length is generally several millimeters.
[0003] Th...