Device and method for measuring dynamic heat conductivity coefficient in silver nanoparticle conductive ink sintering process

Abstract

The invention discloses a device and a method for measuring a dynamic heat conductivity coefficient in a silver nanoparticle conductive ink sintering process. The device comprises an accurate temperature control heating platform, a substrate, a covering substrate, a pressing plate, an injection pump assembly and a power control system; the ink is controlled by the power control system through theinjection pump assembly, and the ink is injected into the sample pattern on the substrate by covering the through hole in the substrate; and the accurate temperature control heating platform is heatedfor measuring the resistivity of the silver nanoparticle ink at different temperatures to obtain the dynamic heat conductivity coefficient of the silver nanoparticle conductive ink in the sintering process. According to the invention, the resistivity of silver at the same temperature is positively correlated with the heat conductivity coefficient; therefore, the dynamic heat conductivity coefficient of the silver nanoparticle conductive ink can be obtained, and the method and device belong to a key technology for preparing the silver nanoparticle conductive ink, optimizing sintering process parameters and the like and improving the quality of printed conductive patterns, and have very important application prospects.

Description

technical field [0001] The invention relates to the technical field of flexible electronics industry printing and sintering, and specifically relates to a device and method for measuring dynamic thermal conductivity during the sintering process of silver nanoparticle ink. Background technique [0002] At present, the technical research on printing and sintering of flexible electronic circuits is mainly concentrated in various printed electronics fields, mainly on the printing quality of conductive circuits. After the conductive circuit is printed using various printing equipment, it is necessary to use a sintering method to make the conductive circuit conductive. After the sintering is completed, the sintering performance of the ink is still being tested for the finished product after sintering. Due to the uniformity of pattern printing and the difference in the sintering effect during the sintering process of the printing equipment, there is a large error between the effec...

AI Technical Summary

Problems solved by technology

Due to the uniformity of pattern printing and the difference in the sintering effect during the sintering process of the printing equipment, there is a large error between the effect of the sintered sample and the actual effect.

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