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a stripping device

A technology of peeling device and driving device, which is applied in the direction of electrical components, electrical components, etc., can solve the problem that the peeling of electronic devices cannot be effectively completed.

Active Publication Date: 2021-04-16
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to propose a stripping device, aiming to solve the problem that the stripping mechanism cannot effectively complete the stripping of electronic devices

Method used

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0045] It should be noted that if there is a directional indication in the embodiment of the present invention, the directional indication is only used to explain the relative positional relationship and movement conditions between the components in a specific posture. If the specific posture changes , then the directional indication changes accordingly.

[0046] In addition, if there are descriptions involving "first", "second" and so on in the embod...

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Abstract

The invention discloses a peeling device, which is used to peel off electronic devices on a grid carrier, including a base, a fixing device, a driving device and a thimble mechanism; the fixing device includes a loading platform, and the loading platform is in the direction of its plane The upper part is movably installed on the base, and one side of the loading platform is provided with an installation area for grid carrier installation, and the loading platform is hollowed out at the location of the installation area; the driving device drives the The loading platform is movable; the thimble mechanism is arranged on the base and is located on the other side of the loading platform, and the thimble mechanism includes a thimble that can be telescopically arranged in a direction close to or away from the loading platform, and the The thimble is arranged corresponding to the installation area, and the thimble can move toward the loading platform to a working position, so as to pass through the installation area and strip the electronic device from the grid of the grid carrier.

Description

technical field [0001] The invention relates to the field of electronic device assembly, in particular to a stripping device. Background technique [0002] During the miniature sensor packaging process, some product components need to be attached to the grid carrier first to complete the assembly of the component. After the components are assembled, they need to be removed one by one and repacked into the carrier tape for later use. However, due to the high viscosity of the tape used to attach the product on the grid carrier, the peeling force of the attached parts exceeds the vacuum adsorption force of the suction nozzle, which makes the suction nozzle unable to directly pick up the parts. Therefore, it is necessary to use an auxiliary mechanism to lift the product from the tape to separate the product from the tape and ensure that the suction nozzle can normally pick up the part. [0003] At present, the peeling mechanism used by packaging equipment for wafer loading gen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
CPCH05K13/0404
Inventor 柴国磊孙有为孙璞仲强
Owner GOERTEK INC