Backlight module, manufacturing method thereof and display device

Abstract

The invention provides a backlight module, a manufacturing method thereof and a display device, relates to the technical field of display, and aims to solve the problem of uneven local or large-area light mixing of an existing backlight module. The manufacturing method of the backlight module comprises the following steps: forming a plurality of first bonding pad groups on a substrate, wherein each first bonding pad group comprises at least two first bonding pads; forming a solder layer, wherein the solder layer comprises solder patterns connected with the first bonding pads in a one-to-one correspondence manner; performing reflow soldering for the first time to enable the solder pattern to form a solder bump structure; placing a corresponding light-emitting chip on one side, back to the substrate, of the solder bump structure corresponding to each first bonding pad group, wherein second bonding pads included in the light-emitting chip are connected with the corresponding solder bump structures in a one-to-one correspondence manner; and performing reflow soldering for the second time, so that the second bonding pads included in the light-emitting chip are electrically connected with the corresponding first bonding pads in a one-to-one correspondence manner through the corresponding solder bump structures. The manufacturing method of the backlight module is used for manufacturing the backlight module.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a backlight module, a manufacturing method thereof, and a display device. Background technique [0002] The traditional miniature light-emitting diode (Mini LED) backlight module mainly includes a substrate and Mini LED chips arrayed on the substrate. When making the backlight module, solder paste is first printed on the substrate, and then the Mini LED chips are placed on the printed surface. On the solder paste, and then through the reflow process, the Mini LED chip is fixed on the substrate. [0003] However, in the reflow soldering process, the volatilization of flux and solvent in the solder paste and the melting of the solder paste can easily cause the pulling of the light-emitting chip, which makes the light-emitting chip placed on the solder paste tilt, so that the light-emitting chip and the surface of the substrate form a certain angle. , resulting in partial or large...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a backlight module and its manufacturing method and display device, which are used to solve the existing problems of the existing backlight module due to the volatilization of flux and solvent in the solder paste and the easy melting of the solder paste during the reflow soldering process. The pulling of the light-emitting chip will cause the light-emitting chip placed on the solder paste to tilt, so that the light-emitting chip will form a certain angle with the surface of the substrate, which will cause local or large-area uneven light mixing in the backlight module.

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