Light-emitting packaging structure and manufacturing method thereof
A technology of packaging structure and manufacturing method, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as the skew of the cover plate 102 and the increase of the failure rate of the packaging structure 100, and achieve the effect of improving the pass rate
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no. 1 example
[0023] like figure 1 Shown is a specific embodiment of a package structure 1 manufactured by the method of the present invention. The package structure 1 has a substrate 10 , a cover plate 20 , a light-emitting unit 30 and an encapsulant 40 . The substrate 10 has two chip mounting pads 11 , and the two chip mounting pads 11 are electrically connected to a pad 13 respectively. The light-emitting unit 30 is disposed on the chip mounting pad 11 of the substrate 10 , so that the light-emitting unit is 30 is electrically connected to the bonding pad 13 through the chip mounting pad 11 . The substrate 10 has a surrounding wall structure 14 on the periphery of one side of the chip mounting pad 11 , and a ring-shaped first bonding area 15 is formed on the side of the surrounding wall structure 14 away from the substrate 10 . The cover plate 20 is disposed on the base plate 10 , an accommodating space 12 is formed between the cover plate 20 and the base plate 10 , and the light-emit...
no. 2 example
[0048] like Figure 10 and Figure 11 As shown, it is another specific embodiment of the light-emitting package structure of the present invention. In this embodiment, the package structure 1 includes: a substrate 10 , a light-emitting unit 30 , and a cover plate 20 . The side of the substrate 10 facing the cover plate 20 has a chip mounting pad 11 , the light emitting unit 30 is disposed on the chip mounting pad 11 , and the side of the substrate 10 facing the cover plate 20 A first bonding area 15 is formed on the periphery of the . The cover plate 20 is a transparent cover plate, and the side of the cover plate 20 facing the substrate 10 has a side wall structure 22 surrounding the outer side of the cover plate. In this embodiment, the first bonding region 15 is formed on the periphery of the substrate 10 facing the cover plate 20 , and the second bonding region 21 is formed on the sidewall structure 22 facing the substrate 10 . side. In this embodiment, the material of...
no. 3 example
[0052] like Figure 12As shown, it is the third embodiment of the packaging structure 1 of the present invention. In this embodiment, the basic structure of the packaging structure 1 is similar to that of the previous embodiments, so the similar parts of the previous embodiments will not be repeated. The difference of this embodiment is that a sub-substrate 17 is disposed on the chip mounting pad 11 of the substrate 10 , the light-emitting unit 30 is further disposed on the sub-substrate 17 , and the package structure 1 further includes a waterproof layer 16. The waterproof layer 16 is at least coated on the surface of the light-emitting unit 30 . The material of the waterproof layer 16 can be selected from silicon-based resin or fluorine-based resin, so as to achieve good waterproof and isolation effects.
[0053] In addition, in this embodiment, an anti-reflection film 23 can also be provided on the surface of the cover plate 20 facing the substrate 10 to reduce the loss of...
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Abstract
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