Diffusion welding method of copper target and aluminum alloy back plate and prepared copper target assembly

A diffusion welding and aluminum alloy technology, which is applied in welding equipment, manufacturing tools, non-electric welding equipment, etc., can solve problems such as the inability to meet the quality requirements for the welding joint degree of copper targets and aluminum alloy backplanes, so as to save raw material costs and expand The effect of contact area and simplification of operation

Inactive Publication Date: 2020-06-19
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology improves the efficiency and accuracy of joining different metals together without requiring complicated operations or expensive equipment. By utilizing specific techniques such as solder fusion for better joint results, this technique simplifies manufacturing processes while reducing costs compared with traditional methods like resistance spot weldings (RSW). Additionally, the use of special alloys called Titanium targets has been found effective at prevention against corrosion due to their ability to diffuse into the metal substrate during heat transfer. Overall, these technical improvements help make more reliable connections made from various types of metals than previously possible.

Problems solved by technology

This patented technical solution describes various techniques for joining two types of materials during diffusing weldings without causing damage such as oxidation or fusion cracks over time. Existing solutions involve either separately applying molten tin onto both sides of the substrate before depositing the desired elements like silver, gold, platinum, etc., or combining these layers after they are applied. These processes require multiple steps and lead to reduced accuracy and reliability issues associated with conventional approaches.

Method used

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  • Diffusion welding method of copper target and aluminum alloy back plate and prepared copper target assembly
  • Diffusion welding method of copper target and aluminum alloy back plate and prepared copper target assembly
  • Diffusion welding method of copper target and aluminum alloy back plate and prepared copper target assembly

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Embodiment 1

[0081] This embodiment provides a method for diffusion welding of a copper target and an aluminum alloy backplane. The diffusion welding method includes the following steps:

[0082] (1) Prepare a cylindrical copper target with a purity of 6N and a diameter of 300 mm. First, use a diamond blade to turn and smooth the welding surface of the copper target, and then clean and dry it. Ultrasonic cleaning with isopropanol cleaning solution for 10 minutes , and then vacuum-dry for 60min under the condition of vacuum degree <0.01Pa; then use the vacuum magnetron sputtering method to coat a layer of titanium film with a thickness of 5 μm on the welding surface of the copper target, the current is 20A, the bias voltage is 100V, and the temperature is 120°C for 3 hours, then cleaning and drying, in which isopropanol cleaning solution is used for ultrasonic cleaning for 10 minutes, and then vacuum drying for 40 minutes under the condition of vacuum degree <0.01Pa;

[0083]Prepare the A50...

Embodiment 2

[0088] This embodiment provides a method for diffusion welding of a copper target and an aluminum alloy backplane. Except that the thickness of the titanium film in step (1) is changed to 3 μm, other conditions are exactly the same as in Embodiment 1.

Embodiment 3

[0090] This embodiment provides a method for diffusion welding of a copper target and an aluminum alloy backplane. Except that the thickness of the titanium film in step (1) is changed to 6 μm, other conditions are exactly the same as in Embodiment 1.

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Abstract

The invention relates to a diffusion welding method of a copper target and an aluminum alloy back plate and a prepared copper target assembly. The diffusion welding method comprises the following steps that (1) a titanium film is coated on the welding surface of the copper target, then the copper target coated with the titanium film and the aluminum alloy back plate are assembled, and then put into a package sleeve as a whole; (2) the package sleeve obtained in step (1) is sealed and then degassed; and (3) the degassed package sleeve in step (2) is subjected to hot isostatic pressure welding,then the package sleeve is removed, and the diffusion welding of the copper target and the aluminum alloy back plate is completed. According to the diffusion welding method, the welding bonding degreebetween the copper target and the aluminum alloy back plate is advantageously improved through the good diffusion of the titanium film; in addition, the titanium film is coated on the welding surfaceof the copper target, the uniformity of the titanium film can be improved, the welding bonding degree is advantageously enhanced, operation can be simplified, and the cost of materials can be saved;and the welding bonding degree of the copper target assembly prepared by the method is more than 99 %.

Description

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Claims

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Application Information

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Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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