an optical module
An optical module and laser technology, which is applied in the field of optical communication, can solve problems affecting the performance of optical modules, achieve good optical alignment stability, avoid heat accumulation, and simplify assembly requirements
Active Publication Date: 2021-11-23
HISENSE BROADBAND MULTIMEDIA TECH
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And if the heat generated inside the optical module cannot be dissipated in time, it will seriously affect the performance of the optical module
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[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0040] One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses optical signals carrying information to be transmitted in information transmission equipment such as optical fibers / optical waveguides, and the passive transmission characteristics of light in optical fibers / optical waveguides can be used to achieve low-cost, low-loss information transmission; and information proces...
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The optical module provided by this application includes: a circuit board; a base, embedded on the circuit board; a laser component, mounted on the base, for emitting light without a signal; a silicon optical chip, mounted on the Installed on the base, the silicon photonics chip is provided with a third optical hole through which the light without signal from the laser component is received; the upper cover of the laser is fixedly connected to the bottom The base is used to cover the laser assembly and seal the laser assembly between the laser upper cover and the base. In the optical module provided by this application, the laser component and the silicon photonic chip are arranged on the base, and the laser component is sealed by the upper cover of the laser, so that the heat dissipation of the laser component and the silicon photonic chip can be directly realized through the base, thereby facilitating the internal heat dissipation of the optical module and avoiding light The internal heat of the module is concentrated and accumulated, and the laser component set on the base is directly wrapped by the laser upper cover, which saves the packaging of the laser component and facilitates the packaging of the laser component.
Description
technical field [0001] The present application relates to the technical field of optical communication, and in particular to an optical module. Background technique [0002] Optical communication technology will be used in new business and application modes such as cloud computing, mobile Internet, and video. In optical communication, the optical module is a tool to realize the mutual conversion of photoelectric signals, and it is one of the key components in optical communication equipment. Among them, the use of silicon photonic chips to realize the photoelectric conversion function has become a mainstream solution adopted by high-speed optical modules. [0003] In the silicon optical module, the silicon optical chip is set on the circuit board, and is electrically connected to the circuit board by bonding; the silicon optical chip is connected to the optical interface of the optical module through an optical fiber ribbon, so that optical signals enter and exit the silico...
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IPC IPC(8): G02B6/42
CPCG02B6/4268G02B6/428G02B6/4296
Inventor 于帮雨董本正孙祥勋邵乾徐发部
Owner HISENSE BROADBAND MULTIMEDIA TECH