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Card slot, main board and main board design method applicable to dual in-line memory module

A dual-in-line, storage module technology, applied in motherboard design, in the field of motherboard design based on dual-in-line storage modules, can solve problems such as low SI performance, and achieve solutions to SI performance degradation, reducing the number of connection layers, cost-increasing effect

Active Publication Date: 2021-07-27
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a card slot, mainboard and mainboard design method suitable for dual-in-line memory modules, so as to solve the technical defects of low SI performance in the prior art

Method used

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  • Card slot, main board and main board design method applicable to dual in-line memory module
  • Card slot, main board and main board design method applicable to dual in-line memory module
  • Card slot, main board and main board design method applicable to dual in-line memory module

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Embodiment 1

[0025] The present invention provides a method for designing a motherboard suitable for dual-in-line memory modules, see figure 1 , including the following steps:

[0026] S1: Obtain the wiring situation of the signal layer, and determine the connection area between each DIMM module and the signal layer according to the wiring situation of the signal layer.

[0027] S2: Determine the ground plane that must be connected to the DIMM module according to the connection area and design the through-hole path of the ground plane.

[0028] S3: In the case of meeting the welding reliability requirements, hollow out the ground pins in the ground layer that the DIMM module does not have to be connected, and form a new ground layer with the preparation of the through-hole path.

[0029] The ground pin of the reference layer of the DIMM signal trace is hollowed out, which will cause discontinuous return flow, which in turn will lead to SI problems such as discontinuous impedance and incre...

Embodiment 2

[0041] image 3 For the DIMM connection method of the processor chip, since there are many DIMMs connected, it needs to go through many layers (more than three layers), that is, a ground plane design with more than three layers is required. but by image 3 It can be seen that each DIMM is independent, so the return grounds of the corresponding traces may also be independent, that is, the ground pins of different DIMMs may not be connected at the same time.

[0042] Figure 4 It is a schematic diagram of the connection area of ​​the DIMM module as a whole. Below to Figure 4 As an example, it elaborates how to hollow out the ground pins in the ground plane of the DIMM module that are not necessarily connected.

[0043] First, based on the wiring condition of the wiring layer, the connection area of ​​the wiring layer is determined.

[0044] Taking the DIMM module to be analyzed as a whole, determine the number of routing layers through observation, and then determine the n...

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Abstract

The invention provides a design method for a card slot, a main board and a main board suitable for a dual-in-line memory module. The method includes the following steps: obtaining the wiring situation of the signal layer, and determining the connection between each DIMM module and the signal layer according to the wiring situation of the signal layer. The connection area of ​​the layer; according to the connection area, determine the ground layer that the DIMM module must be connected to and design the through-hole path of the ground layer; in the case of meeting the soldering reliability requirements, hollow out the ground pin in the ground layer that the DIMM module does not have to be connected , form a new ground layer with the preparation of via holes; use the new ground layer for motherboard preparation. The present invention also provides a card slot and a main board prepared based on the above design method. The invention determines the connection of the DIMM to the ground by analyzing the area of ​​the signal connection, thereby reducing the number of connection layers of each DIMM ground pin. The invention solves the problem of SI performance reduction caused by poor tin penetration, and ensures the SI performance of the main board without increasing the cost.

Description

technical field [0001] The invention belongs to the field of mainboard design, and in particular relates to a design method for a mainboard based on a dual in-line memory module and a mainboard. Background technique [0002] With the improvement of the system speed, especially in the server system, the high-speed parallel bus DDR is constantly updated. As a result, the importance of SI (Signal Integrity, signal integrity) continues to increase, and it is even the key to the success or failure of the design of the high-speed parallel bus DDR. For server motherboards, due to cost factors, DIMMs (Dual Inline Memory Modules, Dual Inline Memory Modules) generally adopt a plug-in packaging method, and the soldering process is wave soldering. In multi-layer board design, in order to ensure good return flow of DDR traces and power supply, that is, good SI performance, the power supply and ground pins of DIMM are connected to many layers of the printed circuit board, usually more th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/16G06F30/392G06F113/18
CPCG06F1/16G06F1/187
Inventor 田民政
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD