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Card slot suitable for double in-line storage module, mainboard and mainboard design method

A dual-in-line, storage module technology, applied in computer-aided design, computing, special data processing applications, etc., can solve the problem of low SI performance, achieve the effect of solving SI performance degradation, ensuring SI performance, and increasing costs

Active Publication Date: 2020-06-26
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a card slot, mainboard and mainboard design method suitable for dual-in-line memory modules, so as to solve the technical defects of low SI performance in the prior art

Method used

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  • Card slot suitable for double in-line storage module, mainboard and mainboard design method
  • Card slot suitable for double in-line storage module, mainboard and mainboard design method
  • Card slot suitable for double in-line storage module, mainboard and mainboard design method

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Embodiment 1

[0025] The present invention provides a method for designing a motherboard suitable for dual-in-line memory modules, see figure 1 , including the following steps:

[0026] S1: Obtain the wiring situation of the signal layer, and determine the connection area between each DIMM module and the signal layer according to the wiring situation of the signal layer.

[0027] S2: Determine the ground plane that must be connected to the DIMM module according to the connection area and design the through-hole path of the ground plane.

[0028] S3: In the case of meeting the welding reliability requirements, hollow out the ground pins in the ground layer that the DIMM module does not have to be connected, and form a new ground layer with the preparation of the through-hole path.

[0029] The ground pin of the reference layer of the DIMM signal trace is hollowed out, which will cause discontinuous return flow, which in turn will lead to SI problems such as discontinuous impedance and incre...

Embodiment 2

[0041] image 3 For the DIMM connection method of the processor chip, since there are many DIMMs connected, it needs to go through many layers (more than three layers), that is, a ground plane design with more than three layers is required. but by image 3 It can be seen that each DIMM is independent, so the return grounds of the corresponding traces may also be independent, that is, the ground pins of different DIMMs may not be connected at the same time.

[0042] Figure 4 It is a schematic diagram of the connection area of ​​the DIMM module as a whole. Below to Figure 4 As an example, it elaborates how to hollow out the ground pins in the ground plane of the DIMM module that are not necessarily connected.

[0043] First, based on the wiring condition of the wiring layer, the connection area of ​​the wiring layer is determined.

[0044] Taking the DIMM module to be analyzed as a whole, determine the number of routing layers through observation, and then determine the n...

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Abstract

The invention provides a card slot suitable for a double in-line storage module, a mainboard and a mainboard design method, and the method comprises the following steps: the wiring condition of a signal layer is obtianed, and a connection region of each DIMM module and the signal layer are determined according to the wiring condition of the signal layer; a grounding layer which must be connected with the DIMM module is determined according to the connection area and a through hole path of the grounding layer is designed; under the condition that the welding reliability requirement is met, thehollowed-out DIMM module is not a ground pin in a ground layer which needs to be connected, and a new ground layer is prepared and formed in cooperation with a through hole path; and the mainboard byusing the new grounding layer is prepared. The invention further provides the card slot and the mainboard which are manufactured based on the design method. According to the invention, the connectionof the DIMM to the ground is determined regionally by analyzing the signal connection region, so that the number of connection layers of each DIMM ground pin is reduced. According to the method, the problem that the SI performance is reduced due to poor tin penetration is solved, and the SI performance of the mainboard is ensured on the premise that the cost is not increased.

Description

technical field [0001] The invention belongs to the field of mainboard design, and in particular relates to a design method for a mainboard based on a dual in-line memory module and a mainboard. Background technique [0002] With the improvement of the system speed, especially in the server system, the high-speed parallel bus DDR is constantly updated. As a result, the importance of SI (Signal Integrity, signal integrity) continues to increase, and it is even the key to the success or failure of the design of the high-speed parallel bus DDR. For server motherboards, due to cost factors, DIMMs (Dual Inline Memory Modules, Dual Inline Memory Modules) generally adopt a plug-in packaging method, and the soldering process is wave soldering. In multi-layer board design, in order to ensure good return flow of DDR traces and power supply, that is, good SI performance, the power supply and ground pins of DIMM are connected to many layers of the printed circuit board, usually more th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/16G06F30/392G06F113/18
CPCG06F1/16G06F1/187
Inventor 田民政
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD