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Lead frame taping apparatus and taping method

A lead frame and tape attaching technology, which is applied in the field of lead frame tape attaching devices, can solve the problems of inspection of defective product reliability changes, high working strength, and failure of adhesive tapes 15a and 15b to bond, etc.

Inactive Publication Date: 2003-07-02
SAMSUNG AEROSPACE IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sometimes the adhesive tapes 15a and 15b cannot be bonded due to high temperature, or the air pressure of the actuator 42 is below the specified value.
Since workers need to check the above-mentioned problems of products in the bonding process, the work intensity is high, and the reliability of checking defective products is constantly changing with the concentration of workers' attention.

Method used

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  • Lead frame taping apparatus and taping method
  • Lead frame taping apparatus and taping method
  • Lead frame taping apparatus and taping method

Examples

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Embodiment Construction

[0035] The lead frame taping apparatus according to the first embodiment of the present invention is illustrated in Figure 4 with 5 middle. As shown in the figure, the lead frame tape attaching apparatus simultaneously attaches tapes 150a, 150b, 150c and 150D to at least two lead frames 100a and 100b (separated by dotted lines) by simultaneous punching.

[0036]The lead frame tape attaching device includes a stamper 110 that is lifted up and down by an actuator 120 and a stamping die 130 . The stamping die 130 has an insertion hole 130a through which the punch 110 passes. The tapes 150a, 150b, 150c and 150d are conveyed by the tape conveying part 140 located between the punch 110 and the stamping die 130 . The tape transfer section 140 has a transfer roller 141 to transfer the tape 150a and a collection roller 142 to collect the vinyl film 150' of the tape 150a.

[0037] Under the stamping die 130, the lead frame 100 is conveyed by the lead frame conveying part 160, and b...

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PUM

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Abstract

In a lead frame taping apparatus and a method thereof, a plurality of punching portions are provided and each punching portion concurrently attaches a tape to at least two lead frames. Also, the tape can be continuously attached to the different kinds of a lead frame without the exchange of molds by differing the operation time of each punching portion. Further, a taping detecting sensor is provided to detect the attachment of the tape at the lead frame. Therefore, productivity is increased while saving labor and inferior products can be accurately detected.

Description

field of invention [0001] The invention relates to a lead frame tape attaching device, more specifically, relates to a lead frame tape attaching device which can utilize a group of punchers to attach adhesive tape to a group of lead frames at the same time. [0002] The present invention also relates to a lead frame taping device having a tape detecting sensor for detecting whether the tape is fixed to the lead frame, and to a tape bonding method using the device. Background technique [0003] A lead frame is an integral part of a semiconductor package, supports a semiconductor chip, and electrically connects the semiconductor chip mounted thereon to an external circuit. Since the lead frame is very small and fragile, the lead frame needs to be carefully manufactured and processed. Due to the development of the semiconductor industry and the increased demand for different semiconductor packages, lead frames of different shapes and sizes are required. As a result, there hav...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50B29C69/00H01L21/00H01L21/52H01L23/50
CPCB29C69/005Y10T156/1313H01L2924/0002H01L21/67144Y10T156/1746Y10T156/125Y10T156/1054H01L2924/00H01L21/52
Inventor 崔五东金钟旭
Owner SAMSUNG AEROSPACE IND