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Substrate processing apparatus and method of processing a substrate and a manufacturing a processed workpiece

A technology for processing equipment and substrates, which is used in semiconductor/solid-state device manufacturing, electrical components, semiconductor/solid-state device testing/measurement, etc., and can solve problems such as difficulty in detecting the actual condition of substrates

Active Publication Date: 2020-07-03
OERLIKON ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially for installations in which the substrate is processed from one side and heated from the side opposite to said side, it is difficult to detect the actual condition of the substrate during its processing

Method used

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  • Substrate processing apparatus and method of processing a substrate and a manufacturing a processed workpiece
  • Substrate processing apparatus and method of processing a substrate and a manufacturing a processed workpiece
  • Substrate processing apparatus and method of processing a substrate and a manufacturing a processed workpiece

Examples

Experimental program
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Embodiment Construction

[0069] The substrate processing apparatus 10 includes a base 19 to be arranged in a vacuum processing chamber. The chamber or enclosure is already in figure 1 , and can be designed as known in the art, including necessary devices for vacuum generation, exhaust gas removal, electrical wiring, and loading / unloading facilities for substrates. The heating element 15 is arranged on said base 19 , preferably mounted parallel to the surface of the base 19 on post(s) 16 providing a gap between the base 19 and said heating element 15 . The heating element may essentially be selected from prior art heating elements such as resistive heaters, especially radiant heaters, or especially preferably carbon or silicon carbide heater arrangements. The substrate 17 may be arranged on a plane again parallel to said base 19 and heating element 15, preferably with a distance between substrate and target of between 5 and 8 centimeters. Said substrate 17 is preferably held by a substrate support 1...

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PUM

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Abstract

A substrate processing apparatus (10) comprises a base (19) with a process-side surface (190), a substrate support (14), arranged on the process-side surface (190) and designed to carry a substrate (17) at its periphery, the periphery, more specifically the plane defined by said periphery, being spaced apart from the process-side surface (190), wherein the substrate processing apparatus (10) further comprises a radiation sensor (21) adapted to measure electromagnetic radiation, arranged on a side of a back-side surface (191) of the base (19), a radiation channel (22, 23, 24, 25, 26), arrangedbetween the radiation sensor (21) and the periphery of the substrate support (14), more specifically between the radiation sensor (21) and the plane defined by said periphery, wherein the radiation channel (22, 23, 24, 25, 26) is at least partially permeable to electromagnetic radiation.

Description

technical field [0001] The invention relates to a substrate processing equipment. The invention also relates to a method of processing a substrate and manufacturing a processed workpiece in such a substrate processing apparatus. [0002] definition [0003] Processing in the sense of the present invention includes any chemical, physical or mechanical effect on the substrate. Furthermore, processing also includes temperature regulation alone or in combination with acting chemical, physical or mechanical effects. Such conditioning should be understood to include: heating the substrate to the desired temperature; maintaining the substrate at the desired temperature; and cooling the substrate to maintain the desired processing temperature, for example where processing itself tends to overheat the substrate . [0004] In the sense of the invention, a substrate is a component, component or workpiece to be processed in a processing plant. Substrates include, but are not limited...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67103H01L21/67109H01L21/67115H01L21/67248H01L22/26
Inventor H.罗曼H.费尔策D.杰格H.布鲁斯
Owner OERLIKON ADVANCED TECH