Unlock instant, AI-driven research and patent intelligence for your innovation.

Mold for preventing substrate from being bent

A bending and substrate technology, applied in the field of molds used to prevent substrate bending, can solve problems such as difficult mold release

Pending Publication Date: 2020-07-07
HITECH SEMICON WUXI
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention proposes a mold for preventing substrate bending, which solves the problem of difficulty in demoulding the mold during the existing chip bonding process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mold for preventing substrate from being bent
  • Mold for preventing substrate from being bent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0016] refer to Figure 1-2 , a mold for preventing substrate bending, comprising a fixed mold 13 and a movable mold 12, the movable mold 12 is arranged above the fixed mold 13, the outer wall of the fixed mold 13 is rotatably connected with a rotating ring 1, and the top of the rotating ring 1 A ring gear plate 2 arranged in a ring is connected, fixed blocks arranged symmetrically are connected to the two side walls of the fixed mold 13, and a gear disc 3 is mounted on the top of the fixed block for rotation, and a threaded rod is connected to the top of the gear disc 3 6. The threaded sleeve of the circumferential side wall of the threaded rod 6 is provided with a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of substrate processing, and particularly discloses a mold for preventing a substrate from being bent. In allusion to the problem of difficult demolding of a mold inthe existing chip bonding process, the following scheme is proposed: the mold comprises a fixed mold and a movable mold, the movable mold is arranged above the fixed mold, the outer wall of the fixedmold is rotationally connected with a rotating ring, the top end of the rotating ring is connected with a toothed ring plate arranged in an annular mode, the two side walls of the fixed mold are connected with fixing blocks which are symmetrically arranged, a gear disc is rotationally mounted at the top end of the fixing block, a threaded rod is connected to the top end of the gear disc, a threaded sleeve is arranged on the circumferential side wall of the threaded rod in a threaded sleeving mode, symmetrically-arranged connecting rings are connected to the two side walls of the movable mold,and the connecting rings are rotationally mounted on the circumferential side wall of the threaded sleeve. The mold is novel in structure, can effectively fix the substrate and prevent the substratefrom being bent, can effectively conduct a demolding operation and prevent the substrate from being attached to the mold, and is suitable for popularization.

Description

technical field [0001] The invention relates to the field of substrate processing, in particular to a mold for preventing substrate bending. Background technique [0002] In the existing chip bonding project, when the substrate is subjected to high temperature, there is a risk of bending, and the uncontrollable factors are relatively high, so the problem of short circuit in the bonding project cannot be controlled. Therefore, we designed a full-size mold and bonded The finished substrate is pressed with a mold to prevent the substrate from bending when it is heated, resulting in short-circuit quality problems, and to achieve commonality between different products. However, due to the high temperature during demoulding, the product may adhere to the substrate. Therefore, in order to solve such problems, we propose a mold for preventing substrate bending. Contents of the invention [0003] The invention proposes a mold for preventing the substrate from bending, which solves...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/67H01L21/673
CPCH01L21/67011H01L21/673
Inventor 张浩
Owner HITECH SEMICON WUXI