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Glue scraping device for production and machining of electronic components

A technology of electronic components and squeegee device, which is applied to the device and coating of the surface coating liquid, which can solve the problems of easily damaged electronic components, insufficient scraping, excessive glue dispensing, etc., to achieve the goal of scraping Good glue effect and convenient range

Active Publication Date: 2020-07-10
宁波铂汉科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing electronic components are usually processed by dispensing. After dispensing, in order to dispensing completely, the amount of dispensing is usually too much, and after the dispensing is completed, the multi-point area will be scraped. , the existing squeegee treatment technology is not enough to scrape off, and it is easy to damage electronic components. Therefore, we propose a squeegee device for the production and processing of electronic components

Method used

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  • Glue scraping device for production and machining of electronic components
  • Glue scraping device for production and machining of electronic components
  • Glue scraping device for production and machining of electronic components

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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] see Figure 1-3 , the present invention provides a technical solution: a scraping device for the production and processing of electronic components, including a conveying device 1, a clamping mechanism 2 is installed on the conveying device 1, and a bracket is fixedly installed on the top of the conveying device 1 3. A support plate 4 is installed on the top of the bracket 3, a dispensing mechanism 5 and a glue scraping mechanism 6 are installed on the ...

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Abstract

The invention discloses a glue scraping device for production and machining of electronic components. The glue scraping device comprises a conveying device. Clamping mechanisms are mounted on the conveying device. Supports are fixedly mounted at the top of the conveying device. A supporting plate is mounted at the tops of the supports. A glue dispensing mechanism and a glue scraping mechanism aremounted on the supporting plate. A driving mechanism is arranged between the glue dispensing mechanism and the glue scraping mechanism, and the glue dispensing mechanism and the glue scraping mechanism are driven by the driving mechanism. According to the glue scraping device for production and machining of the electronic components, a motor drives a first gear and then drives a glue scraping plate to reciprocate to scrape redundant glue on electronic elements dispensed with glue; an adsorption cylinder is pressed outside a glue-dispensing position to clamp a marked glue-dispensing area, and then redundant glue outside a limiting cylinder is adsorbed to be removed through an adsorption pump; and by the adoption of the glue removal method, the glue scraping effect is good, damage to circuitboards is avoided, and the range of a glue scraping area can be controlled conveniently.

Description

technical field [0001] The invention relates to the technical field of electronic component processing, in particular to a squeegee device for production and processing of electronic components. Background technique [0002] Electronic components are components of electronic components and electric small machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as circuit boards, electrical appliances, radios, and instruments. [0003] Existing electronic components are usually processed by dispensing. After dispensing, in order to dispensing completely, the amount of dispensing is usually too much, and after the dispensing is completed, the multi-point area will be scraped. , the existing squeegee treatment technology is not enough to scrape off, and it is easy to damage electronic components. Therefore, we propose a squeegee device for the production and processing of electro...

Claims

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Application Information

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IPC IPC(8): B05C11/10B05C5/02B05C13/02
CPCB05C5/0208B05C11/1039B05C13/02
Inventor 蒲祖玲
Owner 宁波铂汉科技有限公司
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