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Radiator and air conditioner

A heat sink and cooling part technology, applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of high power dissipation, low heat dissipation efficiency of fins, and affecting the service life of power devices, etc., to achieve Ensure the service life, increase the contact area, and improve the effect of heat dissipation

Pending Publication Date: 2020-07-10
GREE ELECTRIC APPLIANCES INC
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing power devices with substrate package dissipate large power, and they are often used as finned radiators behind the device. The installation direction is generally perpendicular to the air duct, and it often occurs that the first fin blocks the convection required by all the fins behind it. In this case, the heat dissipation efficiency of the fin radiator is low, and it only plays a role The effect of heat on the average power device temperature leads to low heat dissipation efficiency of fins and affects the service life of power devices

Method used

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  • Radiator and air conditioner
  • Radiator and air conditioner
  • Radiator and air conditioner

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Embodiment Construction

[0026] see in conjunction Figure 1 to Figure 6 As shown, according to the embodiment of the present application, a heat sink includes a first heat dissipation part 1, a second heat dissipation part 3 and a connecting part 2. The connecting part 2 includes a first segment and a second segment, and the first segment is arranged at the second On the first heat dissipation part 1 , the second section is arranged on the second heat dissipation part 3 , and the connecting part 2 can be bent so that the first heat dissipation part 1 and the second heat dissipation part 3 are arranged at an angle. By providing the connecting part 2, and the connecting part 2 can be bent, and then the first heat dissipation part 1 can be rotated, and then the position and orientation of the first heat dissipation part 1 can be adjusted, so that the first heat dissipation part 1 is parallel to the wind direction of the heat dissipation wind, which can Effectively increase the contact area between the h...

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Abstract

The invention provides a radiator and an air conditioner. The radiator comprises a first heat dissipation part, a second heat dissipation part and a connecting part. The connecting part comprises a first section and a second section, wherein the first section is arranged on the first heat dissipation part, the second section is arranged on the second heat dissipation part, and the connecting partcan be bent so that the first heat dissipation part and the second heat dissipation part can be arranged at an angle. According to the radiator and the air conditioner provided by the embodiment of the invention, the contact area of heat dissipation air and the radiator can be effectively increased, the heat dissipation efficiency of the radiator is improved, and the service life of a power deviceis ensured.

Description

technical field [0001] The application belongs to the technical field of air conditioning, and in particular relates to a radiator and an air conditioner. Background technique [0002] Existing power devices with substrate package dissipate large power, and they are often used as finned radiators behind the device. The installation direction is generally perpendicular to the air duct, and it often occurs that the first fin blocks the convection required by all the fins behind it. In this case, the heat dissipation efficiency of the fin radiator is low, and it only plays a role The effect of heat on the average power device temperature leads to low heat dissipation efficiency of fins and affects the service life of power devices. Contents of the invention [0003] Therefore, the technical problem to be solved in this application is to provide a radiator and an air conditioner, which can effectively increase the contact area between the cooling air and the radiator, improve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/467F24F11/89
CPCF24F11/89H01L23/367H01L23/467
Inventor 周壮广金国华奚明耀吴超徐金辉林肖纯徐华庚齐京墀
Owner GREE ELECTRIC APPLIANCES INC
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