Multilayer films and methods of making the same
A multi-layer thin film and outer layer technology, applied in chemical instruments and methods, coatings, layered products, etc., can solve problems such as decreased work efficiency
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Embodiment 1
[0138] Example 1 illustrates the tensile properties exhibited by an inventive laminate film sample (Sample 1) having an MDO substrate formulated as described herein, compared to a comparative sample of the same thickness having a polyamide substrate ( Sample 1a) compared. The polyethylene and additive products used in the samples included: PE-1 polymer (the first polyethylene described herein) (with bis(n-propylcyclopentadienyl) hafnium dichloride metallocene catalyst Prepared as further described in US Patent No. 6,956,088; Density: 0.916 g / cm 3 ;MI:0.50g / 10min;MIR:29.6;M w : 156,768; MWD: 3.3; M z / M w : 2.4) (ExxonMobil Chemical Company, Houston, Texas, USA), PE-2 polymer (second and third polyethylene described in this paper) (density: 0.940g / cm 3 ; MI: 0.25g / 10min; MIR: >60; MWD: ~4) (ExxonMobil Chemical Company, Houston, Texas, USA), EXXONMOBIL TM HDPE HTA 108HDPE resin (the fourth polyethylene described in this paper) (density: 0.961g / cm 3 ; MI: 0.70g / 10min) (Exx...
Embodiment 2
[0145] Another inventive film sample (Sample 2) was prepared with a sealant layer distribution of 1:3:1 and formulations of sealant outer layer and sealant core layer as shown in Table 2, but otherwise identical to Sample 1. Drop tests were performed on all three samples described in this article to compare drop test performance. Table 3 shows the test results and the non-breakage rate calculated therefrom.
[0146] Table 2: Formula by structure (wt %) and layer thickness of sample 2
[0147]
[0148] Table 3: Rupture Fraction (R 1-3 ) and the non-damage rate (R) calculated from it
[0149] sample number R 1
[0150] From Table 3 it can be seen that the drop test performance of the laminate structure is maintained at a comparable level, if not improved, by replacing the conventional polyamide substrate with the MDO substrate described herein, whether additionally in the sealant The first and second polyethylene compound sealants described herein are used in th...
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