Electronic package and method for fabricating the same
一种电子封装件、电子元件的技术,应用在电气元件、电固体器件、半导体/固态器件制造等方向,能够解决难以缩小无线通讯模块1宽度、基板10宽度难以缩减、无线通讯模块1无法达到微小化等问题
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[0069] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0070] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second" and ...
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