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Electronic package and method for fabricating the same

一种电子封装件、电子元件的技术，应用在电气元件、电固体器件、半导体/固态器件制造等方向，能够解决难以缩小无线通讯模块1宽度、基板10宽度难以缩减、无线通讯模块1无法达到微小化等问题

Active Publication Date: 2020-07-24
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In addition, because the antenna structure 12 is planar, it is necessary to increase the layout area (the area where the packaging material 13 is not formed) on the surface of the substrate 10 to form the antenna body 120, which makes it difficult to reduce the width of the substrate 10, thus It is difficult to reduce the width of the wireless communication module 1, so that the wireless communication module 1 cannot meet the requirement of miniaturization

Method used

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  • Electronic package and method for fabricating the same
  • Electronic package and method for fabricating the same
  • Electronic package and method for fabricating the same

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Embodiment Construction

[0069] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0070] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second" and ...

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Abstract

An electronic package and a method for fabricating the same are provided. An antenna frame, a first electronic component, and a second electronic component electrically connected to the antenna frameare disposed on a lower side of a carrying structure. An antenna structure is disposed on an upper side of the carrying structure and is electrically connected to the first electronic component. Therefore, two different types of antennas are integrated into an identical electronic package. Such the electronic package bonded to a circuit can transmit signals with two different wavelengths, even ifthe electronic package does not have any area increased.

Description

technical field [0001] The present invention relates to an electronic package, in particular to an electronic package with an antenna structure and a manufacturing method thereof. Background technique [0002] Today's wireless communication technology has been widely used in various consumer electronics products (such as mobile phones, tablet computers, etc.) to receive or send various wireless signals. At the same time, in order to meet the portability of consumer electronics products and the convenience of surfing the Internet (such as viewing multimedia content), the manufacture and design of wireless communication modules are developed towards light, thin, short, and small requirements. Among them, the planar antenna (Patch Antenna) ) are widely used in wireless communication modules of electronic products due to their small size, light weight and easy manufacture. [0003] Due to the improvement of the image quality of the current multimedia content, the amount of file...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/22H01Q1/36H01Q1/38H01Q1/50
CPCH01Q1/2283H01Q1/50H01Q1/36H01Q1/38H01L23/3128H01L23/49816H01L23/49894H01L23/5383H01Q21/065H01Q9/0414H01Q21/0087H01L23/66H01L2223/6677H01L2224/48228H01L2924/15321H01L24/16H01L24/48H01L2224/16237H01L2224/32145H01L2224/73253H01L2224/131H01L2224/73265H01L2924/00014H01L2223/6688H01L2924/15192H01L2924/014H01L2224/29099H01L2225/06586H01L23/49822H01L23/49838H01L25/0655H01L25/0657H01L25/50H01L21/4853H01L21/4857H01L21/565H01L2225/0651H01L2225/06517H01L2225/06568H01L24/11H01L21/56H01Q1/40H01L24/27H01Q9/0407H01L23/5389H01L21/77
Inventor 蔡文荣叶懋华邱志贤蔡瀛洲柯俊吉
Owner SILICONWARE PRECISION IND CO LTD
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