Heat dissipation device, production method of heat dissipation device and electronic equipment

Abstract

The invention provides a heat dissipation device. The device comprises a first cover plate, a second cover plate, a capillary core and a working fluid. The first cover plate and the second cover plateare covered to form a closed accommodating space; the capillary core is arranged on a surface, close to the accommodating space, of the first cover plate; the working fluid is filled in the accommodating space; the capillary core comprises a supporting layer and a capillary structure layer; and the supporting layer comprises a plurality of supporting strips and a plurality of hollow areas formedby arranging the supporting strips in a staggered mode, the capillary structure layer is arranged between the supporting layer and the first cover plate, the capillary structure layer comprises a plurality of microstructures arranged on the supporting strips at intervals, and a gap between every two adjacent microstructures is less than a transverse size of each hollow area. Each hollow area doesnot generate a capillary acting force on the working fluid so that interaction between the liquid working fluid in the capillary core and the gaseous working fluid in the accommodating space is avoided, gas-liquid separation is achieved, and heat dissipation performance of the heat dissipation device is improved.

Description

technical field [0001] The application belongs to the technical field of heat conduction, and in particular relates to a heat dissipation device, a preparation method of the heat dissipation device and electronic equipment. Background technique [0002] Electronic equipment generates heat when it is in operation, which directly leads to a sharp rise in the temperature of the electronic equipment. Therefore, it is necessary to quickly dissipate the heat with the help of a heat sink. Taking the vapor chamber as an example, it uses the phase change of the working fluid to transfer heat to complete heat dissipation; however, during this process, the gaseous working fluid in the steam chamber interacts with the liquid working fluid in the capillary structure, causing mutual flow Interference, thereby reducing the heat transfer speed, affecting the heat dissipation effect, or even losing the heat dissipation effect. Contents of the invention [0003] In view of this, the presen...

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Problems solved by technology

Taking the vapor chamber as an example, it uses the phase change of the working fluid to transfer heat to complete heat dissipation; however, during this process, the gaseous working fluid in the steam chamber interacts with the liquid working fluid in the capillary structure, causing mutual flow Interference, thereby reducing the heat transfer speed, affecting the heat dissipation effect, and even losing the heat dissipation effect

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