First control module, second control module, data transmission system and control method
A control module and data packet technology, which is applied in the fields of data transmission system and data transmission control, second control module, and first control module, can solve the problems of low transmission rate, inability to meet the requirements of informatization and intelligence of industrial manufacturing equipment, etc. , to achieve the effect of increasing the data transmission rate
Active Publication Date: 2021-06-01
山东高云半导体科技有限公司
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Problems solved by technology
At present, in order to ensure the accuracy of data transmission, most industrial distributed I / O module products use RS485 bus for master-slave data transmission. However, the transmission rate of data transmission using RS485 bus is low, which cannot meet the needs of industrial manufacturing equipment information. modernized and intelligent requirements
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[0074] The characteristics and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only configured to explain the present invention, not to limit the present invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention.
[0075] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation...
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The invention discloses a first control module, a second control module, a data transmission system and a control method. The first control module includes a first FPGA chip, and the first FPGA chip includes a first BLVDS interface module, a second BLVDS interface module, and a first delay control module; the first BLVDS interface module is electrically connected to the BLVDS clock bus; the second BLVDS The interface module is electrically connected to the BLVDS data bus; the first time delay control module is electrically connected to the second BLVDS interface module, and is used to determine the time delay information required when the second control module sends data to the first control module, and will The time delay information is sent to each second control module, so that each second control module sends data to the first control module according to the determined time delay information. According to the first control module provided by the present invention, the data transmission rate can be improved under the condition that the first control module can ensure that the data is received accurately.
Description
technical field [0001] The invention relates to the technical field of industrial control, in particular to a first control module, a second control module, a data transmission system and a data transmission control method. Background technique [0002] The distributed I / O module is a module developed for the detection and remote control of various types of standard analog quantities and switch quantities (frequency, pulse or switch status signals) in the field of measurement and control. This series of modules digitize the front end of the measured signal and transmit it to the host through optical fiber; or transmit the control command sent by the host to the controlled device for remote control. It is especially suitable for equipment status detection and control of electric power or industrial control field switch cabinets or large power equipment (such as power supplies, air conditioners, motors, etc.) with complex electromagnetic environments. [0003] In recent years...
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IPC IPC(8): G05B19/042
CPCG05B19/0428G05B2219/24024
Inventor 葛庆国
Owner 山东高云半导体科技有限公司