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A kind of preparation method of led lamp

A technology of LED lamps and LED lamp beads, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of large time difference, inability to realize monitoring, and it takes a certain time to respond, so as to achieve a long service life and simplify the structure layout. , the effect of easy temperature control

Active Publication Date: 2021-06-22
福建省信达光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because the LED chip is the heat source, the heat emitted by the LED chip as the heat source is transmitted outward, the farther the distance is, the lower the temperature is, even if the temperature compensation is made, it cannot accurately reflect the real temperature of the LED chip; Or, after the temperature of the LED chip changes, it often takes a certain amount of time for the outside world (the surface of the LED lamp bead or the packaging substrate) to react, and the transmission time difference is large, so timely monitoring cannot be realized

Method used

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  • A kind of preparation method of led lamp
  • A kind of preparation method of led lamp
  • A kind of preparation method of led lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] refer to figure 1 Shown, a kind of preparation method of LED light fixture comprises the steps:

[0034] A1, provide LED bracket, refer to figure 2 , image 3 As shown, the LED bracket includes an insulating bracket body, the surface of the bracket body has a crystal-bonding area, and the crystal-bonding area of ​​the bracket body is provided with a first electrode for fixing the LED chip, and the first electrode is An electrode sheet that is spliced ​​side by side by a first conductor and a second conductor and can generate thermoelectromotive force in a closed circuit; Extending and exposing to form the first pin part, the second conductor extends to the bottom surface (or side surface in other embodiments) of the bracket body and exposing to form the second pin part.

[0035] Specifically, the crystal-bonding area in this step is also provided with a second electrode, and the first electrode 11 is simultaneously used for fixing the LED chip and for connecting the...

Embodiment 2

[0054] The preparation method of an LED lamp provided in this embodiment is roughly the same as the preparation method of Embodiment 1, except that:

[0055] In step A1, refer to Figure 7 As shown, the crystal bonding area of ​​the support body 101 is provided with a second electrode 12 and a third electrode 13 as positive and negative electrodes, and the second electrode 12 faces the bottom surface of the support body 101 (in other embodiments, it can also be The third electrode 13 is extended and exposed to form the third pin portion 121 , and the third electrode 13 extends to the bottom surface of the bracket body 101 (or the side surface in other embodiments) and is exposed to form the fourth pin portion 131 . The first electrode 11 is only used as an electrode for fixing the LED chip 21 .

[0056] Meanwhile, the first conductor 111 of the first electrode 11 is a nickel-chromium alloy, and the second conductor 112 is a copper-nickel alloy. After the first conductor 111 ...

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Abstract

The preparation method of an LED lamp provided by the present invention includes the following steps: A1, providing an LED bracket, which is provided with a first electrode for fixing the LED chip, and the first electrode is composed of a first conductor and a second conductor The electrodes are spliced ​​side by side and can generate thermal electromotive force in a closed loop; A2, fix the LED chip on the first electrode of the LED bracket; A3, provide the package substrate, driving power supply and temperature processor, package the substrate The first electrode pad and the second electrode pad are electrically connected to the driving power supply respectively, and the third electrode pad and the fourth electrode pad of the packaging substrate are connected to the temperature processor; the P electrode of the LED chip is electrically connected to the first electrode pad. plate, the N electrode of which is electrically connected to the second electrode pad; the first pin portion of the LED lamp bead is electrically connected to the third electrode pad, and the second pin portion is electrically connected to the fourth electrode pad .

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to a method for preparing an LED lamp. Background technique [0002] At present, there are many types and models of LED brackets on the market, and most of them are packaged with brackets with two metal electrodes. Or use three or more metal electrodes in the form of thermoelectric separation. When solidifying the crystal, the LED chip is fixed on the corresponding metal bracket, and then a series of processes such as "wire bonding-dispensing-baking-screening-packaging" are carried out to make the finished LED lamp bead. [0003] However, because LED lamp beads are more sensitive to temperature, for example, for a chip with a size of about 10mil*30mil, when the current is 100mA, the brightness of the whole lamp will decrease by 1% for every 4.73°C increase in the temperature of the entire lamp. As the use of current increases, its sensitivity to temperature will further increase, and t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/64
CPCH01L33/483H01L33/62H01L33/647H01L2933/0033H01L2933/0075
Inventor 田晓波谢剑平罗晓东杜涛刘亚男
Owner 福建省信达光电科技有限公司