Double-frequency ultrasonic transducer and ultrasonic detection equipment
A dual-frequency ultrasound and transducer technology, applied in ultrasonic/sonic/infrasonic diagnosis, fixer, sound wave diagnosis, etc., can solve the problem of work efficiency, reception sensitivity, limited application range, low-frequency and high-frequency parts of the transducer Problems such as not being able to work at the same time
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0042] refer to Figure 1-2 , this embodiment adopts the scheme to make further improvements, and provides a dual-frequency single-array ultrasonic transducer with a common backing, that is, the low-frequency unit 10 and the high-frequency unit 20 share the backing layer 4, and the low-frequency unit 10 also includes The low-frequency flexible circuit board layer 3, the low-frequency piezoelectric layer 2 and the low-frequency matching layer 1 are sequentially stacked and arranged on the first side surface of the backing layer 4. The high-frequency flexible circuit board layer 5, the high-frequency piezoelectric layer 6 and the high-frequency matching layer 7 on the second side surface opposite to the side surface;
[0043]Among them, the low-frequency unit 10 can emit low-frequency ultrasonic waves of 1.5-3.5 MHz, and the high-frequency unit 20 can emit high-frequency ultrasonic waves of 12-30 MHz.
[0044] In actual use, for example, the ultrasonic detection of the screw tr...
Embodiment 2
[0046] refer to Figure 3-4 , in the present embodiment, the scheme is further improved, and a dual-frequency linear array ultrasonic transducer with a common backing is provided, which includes a plurality of array elements, specifically:
[0047] The low-frequency unit 10 and the high-frequency unit 20 share the backing layer 4 , and the low-frequency unit 10 further includes a low-frequency flexible circuit board layer 3 , a low-frequency piezoelectric layer 2 and a low-frequency matching layer that are sequentially stacked on the first side surface of the backing layer 4 . 1. The high-frequency unit 20 further includes a high-frequency flexible circuit board layer 5, a high-frequency piezoelectric layer 6 and a high-frequency matching layer 7 that are sequentially stacked on the second side surface of the backing layer 4 opposite to the first side surface;
[0048] The low-frequency piezoelectric layer 2 and the low-frequency matching layer 1 constitute a low-frequency arr...
Embodiment 3
[0054] refer to Figure 5 , in the present embodiment, the scheme is further improved, and a dual-frequency single-array element focused ultrasonic transducer with a common backing is provided, specifically:
[0055] The low-frequency unit 10 and the high-frequency unit 20 share the backing layer 4 , and the low-frequency unit 10 further includes a low-frequency flexible circuit board layer 3 , a low-frequency piezoelectric layer 2 and a low-frequency matching layer that are sequentially stacked on the first side surface of the backing layer 4 . 1. The high-frequency unit 20 further includes a high-frequency flexible circuit board layer 5, a high-frequency piezoelectric layer 6 and a high-frequency matching layer 7 that are sequentially stacked on the second side surface of the backing layer 4 opposite to the first side surface;
[0056] The low-frequency matching layer 1, the low-frequency piezoelectric layer 2, the low-frequency flexible circuit board layer 3, the backing la...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com