MEMS Pump Module

Abstract

A microelectromechanical pump module includes a microelectromechanical chip, a plurality of microelectromechanical pumps, a plurality of switch units and a plurality of control electrodes. The MEMS chip has a chip body, and the chip body is a rectangle with a long side. At least one signal electrode is disposed on the chip body and adjacent to the long side. A plurality of MEMS pumps all have a first electrode and a second electrode, and the second electrode is electrically connected to at least one signal electrode. The multiple switch units are electrically connected to the first electrodes of the multiple MEMS pumps. A plurality of control electrodes are disposed on the chip body and adjacent to the long side, and are respectively electrically connected to the plurality of switch units. At least one signal electrode receives modulated voltage for transmission to the second electrodes of the multiple micro-electro-mechanical pumps, and the multiple switch units are used to control the opening and closing of the multiple micro-electro-mechanical pumps.

Description

[Technical field] [0001] This case is a micro-electrical pump module, which is especially referred to using the setting of the signal electrode to reduce the contact of the microprocessor, and then control the microcomputer pump using the switch unit to simplify the micro-electromechanical pump contacts and wiring. 【Background technique】 [0002] With the current chance of technology, the application of fluid delivery devices is also more diversified, and the industrial applications, medical applications, health care, electronic heat dissipation, etc. Traditional pumps have gradually become trend towards the micro-chemical trend, but the traditional pump is difficult to narrow the size to the class, so the current micro-fluid delivery device can only use a piezoelectric pump structure as a microfluidic transmission device. [0003] Although the microcomputer pump can minimize the volume of the pump to the micron level, the micro-machine electrical pump of the micron grade will li...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of science and technology, the application of fluid conveying devices is becoming more and more diversified. For example, industrial applications, biomedical applications, medical care, electronic heat dissipation, etc., and even the recent popular wearable devices can be seen. It can be seen that Traditional pumps are gradually trending toward miniaturization of devices, but it is difficult to reduce the size of traditional pumps to the millimeter level, so the current micro-fluid delivery devices can only use piezoelectric pump structures as micro-fluid delivery devices

[0003] Although micro-electromechanical pumps can miniaturize the volume of the pump to the micron level, micro-level micro-electromechanical pumps will limit the amount of fluid transfer due to the small volume, so multiple micro-electromechanical pumps are required to be used together. Please refer to figure 1 As shown, at present, a high-end microprocessor 1 is used to control each micro-electromechanical pump separately, but the cost of the high-end microprocessor 1 itself is high, and each micro-electromechanical pump 2 must be connected to a high-end microprocessor The two microprocessor pins 11 of 1 are connected, and then each micro-electromechanical pump 2 is controlled separately through the high-end microprocessor 1, so that the effect of precise control can be achieved, but the cost of the high-end microprocessor 1 will be greatly increased. , leading to high cost of micro-electro-mechanical pump modules, it will also increase the difficulty of packaging and wiring, and it is difficult to popularize. Therefore, how to reduce the cost of micro-electro-mechanical pump modules is the primary difficulty for micro-electro-mechanical pumps to overcome.

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