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A kind of composite encapsulation adhesive film and its application

A technology of encapsulating adhesive film and melting fingers, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem of thin edges of double-glass photovoltaic modules, reduce production costs and labor costs, avoid battery string displacement, The effect of increasing productivity

Active Publication Date: 2022-04-01
常州汉韦聚合物有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of thin edges of double-glass photovoltaic modules in the prior art, the present invention provides a composite encapsulation adhesive film with edge thickness self-compensation function and its application in double-glass photovoltaic modules, which meets the requirements of double-glass photovoltaic modules. 30-year high service life requirements for glass photovoltaic modules outdoors

Method used

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  • A kind of composite encapsulation adhesive film and its application
  • A kind of composite encapsulation adhesive film and its application
  • A kind of composite encapsulation adhesive film and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] like figure 1 As shown, a composite encapsulation film with a thickness of 500 μm includes a high-melt-finger encapsulation film with a melting index of 25g / min and a low-melt-finger encapsulation film with a melt index of 22g / min. The thickness of the melting finger packaging adhesive film is thick in the middle and thin at the edge, and the thickness of the low melting finger packaging adhesive film is thin in the middle and thick at the edge; at the boundary of the composite packaging adhesive film, the thickness of the low melting finger adhesive film is 400 μm.

[0022] The base material of the high-melt finger packaging adhesive film and the base material of the low-melt finger packaging adhesive film are both polyolefins, and the polyolefin satisfies a volume resistivity of 10 after film formation. 16 Ω·cm, the thermal melting point is 90°C, and the melting index is 25g / min and 22g / min respectively.

Embodiment 2

[0024] like figure 2 As shown, a composite encapsulation film with a thickness of 450 μm includes a high-melt-finger encapsulation film with a melting index of 25 g / min and a low-melt-finger encapsulation film with a melt index of 15 g / min. The thickness of the melting finger packaging adhesive film is thick in the middle and thin at the edge, and the thickness of the low melting finger packaging adhesive film is thin in the middle and thick at the edge; at the boundary of the composite packaging adhesive film, the thickness of the low melting finger adhesive film is 450 μm.

[0025] The base material of the high-melt finger packaging adhesive film and the base material of the low-melt finger packaging adhesive film are both polyolefins, and the polyolefin satisfies a volume resistivity of 10 after film formation. 16 Ω·cm, thermal melting point is 100°C, melting index is 25g / min and 15g / min respectively.

Embodiment 3

[0027] like image 3 As shown, a composite encapsulation film with a thickness of 1000 μm comprises a layer of high-melt-finger encapsulation film with a melting index of 25g / min and a layer of low-melt-finger encapsulation film with a melt index of 18g / min. The thickness of the melting finger packaging adhesive film is thick in the middle and thin at the edge, and the thickness of the low melting finger packaging adhesive film is thin in the middle and thick at the edge; at the boundary of the composite packaging adhesive film, the thickness of the low melting finger adhesive film is 600 μm.

[0028] The base material of the high-melt-finger packaging adhesive film and the base material of the low-melt-finger packaging adhesive film are both cationic polymers, and the polyolefin satisfies the volume resistivity of 2*10 after film formation. 15 Ω·cm, the thermal melting point is 80°C, and the melting indices are 25g / min and 18g / min respectively.

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Abstract

The invention belongs to the technical field of adhesive films, and in particular relates to a composite packaging adhesive film and its application. The composite packaging adhesive film of the present invention comprises at least one layer of high melting finger packaging adhesive film and at least one layer of low melting finger packaging adhesive film, the thickness of the high melting finger packaging adhesive film is thick in the middle and thin at the edge, and the thickness of the low melting finger packaging adhesive film is The thickness of the packaging film is thinner in the middle and thicker at the edges. Also provided is the application of the composite encapsulation adhesive film in double-glass photovoltaic modules. The composite encapsulation adhesive film of the present invention uses a high-melt-finger encapsulation film and a low-melt-finger encapsulation film together, and has the edge self-compensation function, which effectively solves the problems caused by the thinner edge of the double-glass photovoltaic module. Problems such as a sharp drop in power.

Description

technical field [0001] The invention belongs to the technical field of adhesive films, and in particular relates to a composite packaging adhesive film and its application. Background technique [0002] Double-glass photovoltaic modules have a 30-year warranty, 21% higher life cycle power generation than ordinary modules, good wear resistance, can meet higher system voltage, high fire rating, and can be used in traditional solar panels with high humidity and large salt spray. Where the component is not applicable. In recent years, double-glass photovoltaic modules have become popular due to their superior quality compared with traditional modules, but they also face some challenges: as the outdoor service time of double-glass modules prolongs, bubbles and delamination appear at the four corners, and the bus bar area at the head and tail Delamination, delamination of the long edge along the cell edge, etc. In the laboratory aging test, there are also problems such as black ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/048
CPCH01L31/0481Y02E10/50
Inventor 施瑕玉李政林俊良林金汉林金锡
Owner 常州汉韦聚合物有限公司