Composite packaging adhesive film and application thereof
An encapsulation film and melting finger technology, applied in photovoltaic power generation, electrical components, circuits, etc., can solve the problems of thin edge of double-glass photovoltaic modules, reduce production costs and labor costs, increase production capacity, and avoid battery strings. shift effect
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Embodiment 1
[0021] Such as figure 1 As shown, a composite packaging adhesive film with a thickness of 500 μm includes a layer of high-melting finger packaging adhesive film with a melting index of 25 g / min and a layer of low-melting finger packaging adhesive film with a melting index of 22 g / min. The thickness of the melt finger encapsulation film is thick in the middle and thin at the edge, and the thickness of the low melt finger encapsulation film is thick in the middle and thin edge; at the boundary of the composite encapsulation film, the thickness of the low melt finger is 400μm.
[0022] The base material of the high-melt index encapsulating adhesive film and the base material of the low-melting index encapsulating adhesive film are both polyolefins, and the polyolefin satisfies the volume resistivity of 10 after film formation. 16 Ω·cm, thermal melting point is 90℃, melting index is 25g / min and 22g / min respectively.
Embodiment 2
[0024] Such as figure 2 As shown, a composite packaging adhesive film with a thickness of 450 μm includes a layer of high-melting finger packaging adhesive film with a melting index of 25 g / min and a layer of low-melting finger packaging adhesive film with a melting index of 15 g / min. The thickness of the melt finger encapsulation film is thick in the middle and thin at the edge, and the thickness of the low melt finger encapsulation film is thick in the middle and thin edge; at the boundary of the composite encapsulation film, the thickness of the low melt finger is 450μm.
[0025] The base material of the high-melt index encapsulating adhesive film and the base material of the low-melting index encapsulating adhesive film are both polyolefins, and the polyolefin satisfies the volume resistivity of 10 after film formation. 16 Ω·cm, thermal melting point is 100℃, melting index is 25g / min and 15g / min respectively.
Embodiment 3
[0027] Such as image 3 As shown, a composite packaging adhesive film with a thickness of 1000 μm includes a layer of high-melting finger packaging adhesive film with a melt index of 25 g / min and a layer of low-melting finger packaging adhesive film with a melting index of 18 g / min. The thickness of the melt finger encapsulation film is thick in the middle and thin at the edge, and the thickness of the low melt finger encapsulation film is thick in the middle and thin edge; at the boundary of the composite encapsulation film, the thickness of the low melt finger is 600μm.
[0028] The base material of the high-melt index encapsulating adhesive film and the base material of the low-melting index encapsulating adhesive film are both cationic polymers, and the polyolefin meets the requirement that the volume resistivity after film formation is 2*10 15 Ω·cm, thermal melting point is 80℃, melting index is 25g / min and 18g / min respectively.
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Abstract
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