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Composite packaging adhesive film and application thereof

An encapsulation film and melting finger technology, applied in photovoltaic power generation, electrical components, circuits, etc., can solve the problems of thin edge of double-glass photovoltaic modules, reduce production costs and labor costs, increase production capacity, and avoid battery strings. shift effect

Active Publication Date: 2020-08-07
常州汉韦聚合物有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of thin edges of double-glass photovoltaic modules in the prior art, the present invention provides a composite encapsulation adhesive film with edge thickness self-compensation function and its application in double-glass photovoltaic modules, which meets the requirements of double-glass photovoltaic modules. 30-year high service life requirements for glass photovoltaic modules outdoors

Method used

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  • Composite packaging adhesive film and application thereof
  • Composite packaging adhesive film and application thereof
  • Composite packaging adhesive film and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Such as figure 1 As shown, a composite packaging adhesive film with a thickness of 500 μm includes a layer of high-melting finger packaging adhesive film with a melting index of 25 g / min and a layer of low-melting finger packaging adhesive film with a melting index of 22 g / min. The thickness of the melt finger encapsulation film is thick in the middle and thin at the edge, and the thickness of the low melt finger encapsulation film is thick in the middle and thin edge; at the boundary of the composite encapsulation film, the thickness of the low melt finger is 400μm.

[0022] The base material of the high-melt index encapsulating adhesive film and the base material of the low-melting index encapsulating adhesive film are both polyolefins, and the polyolefin satisfies the volume resistivity of 10 after film formation. 16 Ω·cm, thermal melting point is 90℃, melting index is 25g / min and 22g / min respectively.

Embodiment 2

[0024] Such as figure 2 As shown, a composite packaging adhesive film with a thickness of 450 μm includes a layer of high-melting finger packaging adhesive film with a melting index of 25 g / min and a layer of low-melting finger packaging adhesive film with a melting index of 15 g / min. The thickness of the melt finger encapsulation film is thick in the middle and thin at the edge, and the thickness of the low melt finger encapsulation film is thick in the middle and thin edge; at the boundary of the composite encapsulation film, the thickness of the low melt finger is 450μm.

[0025] The base material of the high-melt index encapsulating adhesive film and the base material of the low-melting index encapsulating adhesive film are both polyolefins, and the polyolefin satisfies the volume resistivity of 10 after film formation. 16 Ω·cm, thermal melting point is 100℃, melting index is 25g / min and 15g / min respectively.

Embodiment 3

[0027] Such as image 3 As shown, a composite packaging adhesive film with a thickness of 1000 μm includes a layer of high-melting finger packaging adhesive film with a melt index of 25 g / min and a layer of low-melting finger packaging adhesive film with a melting index of 18 g / min. The thickness of the melt finger encapsulation film is thick in the middle and thin at the edge, and the thickness of the low melt finger encapsulation film is thick in the middle and thin edge; at the boundary of the composite encapsulation film, the thickness of the low melt finger is 600μm.

[0028] The base material of the high-melt index encapsulating adhesive film and the base material of the low-melting index encapsulating adhesive film are both cationic polymers, and the polyolefin meets the requirement that the volume resistivity after film formation is 2*10 15 Ω·cm, thermal melting point is 80℃, melting index is 25g / min and 18g / min respectively.

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Abstract

The invention belongs to the technical field of adhesive films, and particularly relates to a composite packaging adhesive film and application thereof. The composite packaging adhesive film comprisesat least one layer of a high-melting-index packaging adhesive film and at least one layer of a low-melting-index packaging adhesive film, wherein the thickness of the high-melting-index packaging adhesive film is thick in the middle and thin in the edge, and the thickness of the low-melting-index packaging adhesive film is thin in the middle and thick in the edge. The invention also provides an application of the composite packaging adhesive film in a double-glass photovoltaic module. According to the composite packaging adhesive film, the high-melting-index packaging adhesive film and the low-melting-index packaging adhesive film are used in cooperation, so that the edge self-compensation function is achieved, and the problems that due to the fact that the edge of a double-glass photovoltaic module is thin, a battery sheet is black, and the power is sharply reduced are effectively solved.

Description

Technical field [0001] The invention belongs to the technical field of adhesive films, and specifically relates to a composite packaging adhesive film and applications thereof. Background technique [0002] Double-glass photovoltaic modules have a 30-year warranty, 21% higher life cycle power generation than ordinary modules, good abrasion resistance, can meet higher system voltage, high fire rating, and can be used in traditions such as high humidity and heavy salt spray Places where the component is not applicable. In recent years, double-glass photovoltaic modules have become popular due to their superior quality compared to traditional modules, but they also face some challenges: with the prolonged outdoor service time, double-glass photovoltaic modules have bubbles and delamination in the four corners, and busbar areas at the head and tail. Delamination, delamination of the long edge along the edge of the cell, etc. In the laboratory burn-in test, there are also problems s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/048
CPCH01L31/0481Y02E10/50
Inventor 施瑕玉李政林俊良林金汉林金锡
Owner 常州汉韦聚合物有限公司