Semiconductor module and life prediction system for semiconductor module
A technology of life prediction and semiconductor, which is used in semiconductor working life test, single semiconductor device test, measurement of electricity, etc., can solve the problem of decreased measurement accuracy, cannot accurately predict the life of semiconductor modules, etc., and achieve the effect of accurate life.
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Embodiment approach 1
[0018]
[0019] figure 1 It is a figure which shows an example of the structure of the lifetime prediction system of the semiconductor power module which concerns on this Embodiment 1.
[0020] like figure 1 As shown, the semiconductor power module lifetime prediction system according to the first embodiment is composed of a semiconductor power module 1 and an MCU (Micro Controller Unit; micro control unit) 7 . The semiconductor power module 1 controls the operation of the load 10 . Load 10 is, for example, a three-phase AC motor or the like.
[0021] The semiconductor power module 1 has a control circuit 4, a memory 6, and IGBTs 2a, 2b and diodes 3a, 3b as semiconductor elements. The control circuit 4 has measurement circuits 5 a , 5 b , inverters 11 a , 11 b , drive circuits 9 a , 9 b , an input interface 8 , and an input-output interface 12 .
[0022] Measurement circuits 5a, 5b measure the characteristics of IGBTs 2a, 2b and diodes 3a, 3b. Specifically, the measurem...
Embodiment approach 2
[0043]
[0044] The configuration of the lifetime prediction system for semiconductor power modules according to Embodiment 2 is the same as that described in Embodiment 1. figure 1 The structure of the lifetime prediction system of the semiconductor power module shown is the same, so detailed description is omitted here. In addition, the operation of the semiconductor power module 1 is also the same as that of the first embodiment, so detailed description thereof will be omitted here.
[0045]
[0046] In the second embodiment, the method of predicting the life of the semiconductor power module 1 by the MCU 7 is different from that in the first embodiment. Hereinafter, prediction of the lifetime of the semiconductor power module 1 according to the second embodiment will be described.
[0047] The MCU 7 reads the respective measured values of the IGBTs 2a, 2b and the diodes 3a, 3b and the initial values of the characteristics of the IGBTs 2a, 2b, and the diodes 3a, 3b...
Embodiment approach 3
[0054]
[0055] Figure 4 It is a figure which shows an example of the structure of the lifetime prediction system of the semiconductor power module concerning this Embodiment 3.
[0056] like Figure 4 As shown, the lifetime prediction system of the semiconductor power module according to the third embodiment is constituted by the semiconductor power module 13 , the MCU 15 , and the case temperature measurement circuit 16 . The semiconductor power module 13 controls the operation of the load 10 .
[0057] The semiconductor power module 13 has a control circuit 4, a memory 14, IGBTs 2a, 2b and diodes 3a, 3b as semiconductor elements. The control circuit 4 has an input interface 8 and drive circuits 9a, 9b. In addition, the input interface 8 and the drive circuits 9a, 9b are the same as those described in Embodiment 1. figure 1 The illustrated input interface 8 and the drive circuits 9a, 9b are the same, so descriptions are omitted here.
[0058] The memory 14 is compose...
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