Micro-electromechanical device service life prediction method based on single acceleration factor

A technology for acceleration factor and life prediction, which is applied in the testing of mechanical components, testing of machine/structural components, instruments, etc. It can solve the problems of insufficient accelerated life testing methods for MEMS devices.

Pending Publication Date: 2021-07-06
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the shortcoming of above-mentioned prior art, provide a kind of MEMS device life

Method used

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  • Micro-electromechanical device service life prediction method based on single acceleration factor
  • Micro-electromechanical device service life prediction method based on single acceleration factor
  • Micro-electromechanical device service life prediction method based on single acceleration factor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] Embodiment 1 temperature stress (constant stress)

[0071] Step 1, record the initial temperature value of the electromagnetic MEMS micromirror environment;

[0072] This test selects the electromagnetic MEMS micromirror as the test object. The torsion beam of the micromirror is the key part of the whole product; there are many factors that affect the failure of the torsion silicon beam, such as the amplitude of cyclic stress, temperature and other environmental factors.

[0073] In order to calculate the corresponding parameters to obtain the acceleration coefficient under different temperature stresses, design at least two groups of temperature stress tests a and b. The test first measures the initial temperature value of the MEMS device in the test box, and places 20 pieces of MEMS micromirrors in an oven for heating. The heating temperatures of the oven are 80°C and 120°C respectively. The capacitance value and resistance value of the circuit, as well as the reson...

Embodiment 2

[0084] Step 1, select the appropriate cyclic stress according to the test object;

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PUM

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Abstract

The invention discloses a micro-electromechanical device life prediction method based on a single acceleration factor, and the method needs to consider the influence of temperature stress and cyclic stress on the life of an MEMS device in an accelerated life test in order to accurately predict the life of the MEMS device under the single acceleration factor. According to the accelerated life test, stress (such as temperature stress, cyclic stress and the like) higher than the normal level is applied to a product in a short time in an accelerated environment with an abnormal stress level, and the service life of the MEMS device can be predicted according to test data obtained by an alternative test, and related parameters of the accelerated life test mathematical model are deduced in the temperature stress and cyclic stress environment, and the life of the MEMS device in the temperature stress and cyclic stress environment.

Description

technical field [0001] The invention belongs to the testing field of micro-electromechanical devices, in particular to a method for predicting the service life of micro-electromechanical devices based on a single acceleration factor. Background technique [0002] With the development of micro-electromechanical system technology (MEMS), MEMS devices have been widely used in the fields of communication, detection, and sensing. MEMS devices based on microstructure have many reliability problems, such as temperature, humidity, vibration, and shock can all affect their working stability; and the reliability mechanism of these parameters on MEMS devices is relatively complicated, which has become its major bottleneck in development. Therefore, the reliability research and life prediction of MEMS devices have important theoretical and practical significance for the practical application of MEMS devices. [0003] In order to accurately predict the life of MEMS devices in a short p...

Claims

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Application Information

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IPC IPC(8): G01M13/00G01N17/00G01N25/00G06F30/20G06F119/02G06F119/14
CPCG01M13/00G01N17/00G01N25/00G06F30/20G06F2119/02G06F2119/14
Inventor 李运甲窦伟滔高屹森
Owner XI AN JIAOTONG UNIV
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