Air-cooled host case with internal environment temperature adjusting function and method

A temperature-adjusting, air-cooled technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of inability to dissipate heat, easy to be attached by dust, slow heat dissipation, etc., to achieve good dust-proof effect, Prevent dust from spreading and avoid the effect of air cooling and heat dissipation for too long

Active Publication Date: 2020-08-14
深圳市智微智能软件开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When dissipating heat, or directly fix a fan in the case to make it continuously blow toward the CPU, in this way, the fan, the main control board and the electronic components on the main control board are easy to be attached by dust; or directly on the

Method used

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  • Air-cooled host case with internal environment temperature adjusting function and method
  • Air-cooled host case with internal environment temperature adjusting function and method
  • Air-cooled host case with internal environment temperature adjusting function and method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0028] Example one

[0029] The embodiment of the present invention provides an air-cooled host chassis with an internal environment temperature adjustment function, such as Figure 1-Figure 3 As shown, the mainframe is included; the mainframe includes a left side plate 11 and a right side plate 12; the inner wall of the left side plate 11 is fixed with a longitudinal main control board 13; the main control board 13 is fixed with a CPU14; A horizontal turntable 15 is provided, a rotating assembly 16 that drives the turntable 15 to rotate on a horizontal plane, a lower fan plate 17 fixed at the middle of the upper surface of the turntable 15, and a first heat dissipation assembly 18 distributed on both sides of the lower fan plate 17 And the second heat dissipation component 19;

[0030] The first heat dissipation assembly 18 includes a first iron block 110, a heat conduction pin group 111 fixed to the left side surface of the first iron block 110 and adapted to the CPU 14, and a f...

Example Embodiment

[0049] Example two

[0050] The embodiment of the present invention provides a method for using an air-cooled mainframe chassis. Based on the air-cooled mainframe chassis with an internal environment temperature adjustment function provided in the first embodiment, the method includes the following steps:

[0051] Step S101: Enable air cooling

[0052] The electromagnet is energized to absorb the first iron block and the second iron block, the heat conducting pin group and the first heat dissipation fin group return to the turntable, and the upper fan plate and the lower fan plate are close together;

[0053] The rotating assembly drives the turntable to reciprocate, and the lower fan plate and the upper fan plate cooperate to fan the main control board and the electronic components installed on the main control board;

[0054] Step S102: Start the heat dissipation of the thermal pin group

[0055] After air cooling for a certain period of time, the rotating assembly drives the turntab...

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Abstract

The invention relates to an air-cooled host case with the internal environment temperature adjusting function and a method. The host case comprises a host case body. The host case body comprises a left side plate and a right side plate; a main control panel is fixedly arranged on the left side plate; a CPU is fixedly arranged on the main control board; a turntable, a rotating assembly, a lower fanplate, a first heat dissipation assembly and a second heat dissipation assembly are arranged in the host case; the first heat dissipation assembly comprises a first iron block, a heat conduction needle set and a first reset spring. The second heat dissipation assembly comprises a second iron block, a mounting plate, a first heat dissipation fin group and a second reset spring; an upper fan plateis also arranged in the host case; the upper fan plate is fixed with the transverse plate body of the mounting plate; an electromagnet is fixedly arranged on the surface of the right side of the lowerfan plate; a first movable through groove is formed in the right side plate; the first movable through groove allows the heat conduction needle set or the first cooling fin set to penetrate out of the host case. The computer case is flexible and diverse in heat dissipation mode, more efficient in heat absorption and heat dissipation and good in dustproof effect.

Description

technical field [0001] The present invention relates to the technical field of mainframe chassis, and more specifically, relates to an air-cooled mainframe chassis with an internal environment temperature adjustment function and a method thereof. Background technique [0002] The computer case is mainly used to place and fix various computer accessories, including the main control board. When dissipating heat, or directly fix a fan in the chassis, so that it continues to blow air towards the CPU. In this way, the fan, the main control board and the electronic components on the main control board are easy to be attached by dust; or directly on the The main control board is covered with a layer of heat-conducting silica gel. In this way, the heat-conducting silica gel is fixed. After absorbing heat, it cannot directly dissipate heat outside the computer case, and the heat dissipation speed is slow. Contents of the invention [0003] The technical problem to be solved by the...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/181G06F1/206
Inventor 周源鑫潘德义王海利
Owner 深圳市智微智能软件开发有限公司
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