Foot pad picking and placement mechanism

Abstract

The invention relates to the field of automatic equipment, and particularly discloses a foot pad picking and placement mechanism. The foot pad picking and placement mechanism comprises a support, a mechanical arm driving the support to move in a three-dimensional space, at least one second elastic suction assembly arranged on the support, and a driving device driving the second elastic suction assembly to move up and down relative to the support, wherein the second elastic suction assembly comprises a connecting plate, a second vacuum suction head connected with the connecting plate, a sleeveand an elastic piece; the outer periphery of the second vacuum suction head is coaxially sleeved by the sleeve; the elastic piece is arranged between the sleeve and the connecting plate, and can extend and retract along the central axis of the second vacuum suction head; and in an initial state, one end of the sleeve extends out of a suction end of the second vacuum suction head. The foot pad picking and placement mechanism disclosed by the invention has the advantages that a foot pad can be accurately picked and placed, so that the problem that the foot pad is omitted during adhesion is effectively solved, and the use is more convenient.

Description

【Technical field】 [0001] The invention relates to the field of automation equipment, in particular to a foot pad pick-and-place mechanism. 【Background technique】 [0002] Existing electronic products such as notebooks, mice, keyboards, etc., usually attach foot pads at the bottom in order to reduce wear and shock absorption. In assembly, a pick-and-place mechanism is usually used to remove multiple foot pads on the foot pad accessories in sequence, and move to the assembly position to stick on the product. [0003] Existing pick-and-place mechanisms are generally divided into two types. One is to use grippers to hold and place, but due to the small size of the pads, it is not easy to clamp, and the clamping force is too large to easily damage the pads; the other is Pick-and-place by vacuum suction, that is, the foot pad is absorbed by the suction head, and then moved to the assembly position by the manipulator. However, when the vacuum adsorption force is small and the coh...

AI Technical Summary

Problems solved by technology

[0003] Existing pick-and-place mechanisms are generally divided into two types. One is to use grippers to hold and place, but due to the small size of the pads, it is not easy to clamp, and the clamping force is too large to easily damage the pads; the other is Pick-and-place by vacuum suction, that is, the foot pad is absorbed by the suction head, and then moved to the assembly position by the manipulator

However, when the vacuum adsorption force is small and the bonding force between the foot pad and the foot pad auxiliary material is large, it is difficult to remove the foot pad from the foot pad auxiliary material, resulting in the leakage of the foot pad.

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