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Modular computer dustproof heat dissipation device

A cooling device and computer technology, applied in computing, instruments, electrical digital data processing, etc., can solve the problems of difficult installation and disassembly, poor heat dissipation effect, troublesome cleaning, etc., and achieve simple installation and disassembly, simple operation, and convenient cleaning Effect

Inactive Publication Date: 2020-08-28
广西轻舟信息科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a modular computer dust-proof and heat-dissipating device, which has the advantages of dust-proof, good heat-dissipating effect, convenient installation and disassembly of the dust-proof net, convenient installation and disassembly of the cooling fan, and easy cleaning. The existing device is easy to enter the dust, the heat dissipation effect is poor, it is not easy to install and disassemble, and it is troublesome to clean up.

Method used

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  • Modular computer dustproof heat dissipation device
  • Modular computer dustproof heat dissipation device
  • Modular computer dustproof heat dissipation device

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] see Figure 1-12 , a modular computer dust-proof heat dissipation device, including a box body 1, used for installation and fixing of related structures, the side of the box body 1 is provided with an air inlet 2 for the entry of air, and the air inlet 2 is located inside the box body 1 The side where the hardware is centrally installed allows the incoming air to directly contact the hardware, take away the heat generated by the hardware, and improve th...

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Abstract

The invention relates to the technical field of software development computer technology development. The invention further discloses a modular computer dustproof heat dissipation device. The modularcomputer dustproof heat dissipation device includes a box body, wherein an air inlet is formed in the side surface of the box body; a positioning frame is arranged outside the air inlet; a groove is formed in the positioning frame; a fixed block is arranged at the upper part of the positioning frame; the surface of the fixed block is fixedly connected with a fixed shaft; the end, away from the fixed block, of the fixed shaft is fixedly connected with a fixed cap; a dustproof net is arranged on the surface of the air inlet; and a positioning edge is arranged on the surface of the dustproof net.Through cooperative use of the dustproof net and the positioning frame, the modular computer dustproof heat dissipation device enables floating objects such as dust in air to be not prone to enteringthe box body, and keeps the heat dissipation effect in the box body and normal operation of hardware; and through cooperative use of the dustproof net, the fixed blocks and the grooves, the dustproofnet is easier to mount and dismount, and regular cleaning of the dustproof net is facilitated.

Description

technical field [0001] The invention relates to the technical field of software development and computer technology development, in particular to a modularized computer dust-proof and heat-dissipating device. Background technique [0002] With the rapid development of social economy, more and more computers are used, which can be seen everywhere in our life, study and work. For desktop computers, the existence of computer hosts is indispensable. The quality of the computer directly determines the experience of using the computer. [0003] Among the existing mainframes, fan blades are used most to dissipate heat. Through the rotation of the fan blades inside the case, the air outside the case is exchanged with the air inside, which is used to take away the heat inside the case to achieve the effect of heat dissipation. In this process During the operation, with the flow of air, floating objects such as dust in the air will enter the inside of the chassis and adhere to the su...

Claims

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Application Information

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IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 严艺勇
Owner 广西轻舟信息科技有限公司