15 results about "Modular computations" patented technology

The invention relates to the technical field of cryptology, and belongs to a CPA security post-quantum network communication method based on a TLCP protocol, a CPA security Kyber key exchange mechanism is constructed, the CPA security Kyber key exchange mechanism is seamlessly embedded into a TLCP protocol framework, and collaborative improvement of security, high efficiency and compatibility is achieved. A Kyber core algorithm is constructed based on an anti-quantum-attack LWE problem, a CPA security model of the Kyber core algorithm effectively resists quantum computing threats, and the requirements of satellite communication and other high-security scenes are met; in the aspect of high efficiency, a ciphertext verification step of Fujissaki-Okamoto (FO) conversion is skipped, so that the modular computation amount is remarkably reduced, and the key negotiation speed is increased; in the aspect of compatibility, a post-quantum key negotiation mechanism and a TLCP protocol can be seamlessly fused, other processes of the protocol can be compatible, and the adaptability and autonomous controllability of the system in a password standard system are improved.

The invention provides a spacecraft modular computing cloud platform and an OpenStack reconfigurable method.According to the platform, a plurality of computing nodes are interconnected through a high-speed bus and matched with a dual-redundancy PMC board card to achieve hardware monitoring and fault control, a system deconstructs OpenStack into an SGC containerized service unit, and on-demand cutting deployment and resource scheduling are achieved in combination with an assembly bus; and designing a multi-stage operation process, such as a platform power-up management domain, computing node power-up diagnosis, software starting registration, cloud service initialization, business virtual machine deployment and a second-level fault detection and automatic recovery mechanism. Compared with the prior art, the deployment and maintenance cost is greatly reduced, the reliability and flexibility of the system are improved, the problems that the original OpenStack fault processing is time-consuming and depends on manpower are solved, and the method is suitable for high-reliability demand scenes such as spacecraft on-board data processing and edge calculation.

This disclosure provides a method, apparatus, and device medium for GPU redundancy deployment based on AI server supernodes. The method includes: acquiring and adjusting the internal and external interfaces of GPUs in a modular computing unit; configuring link paths for the nine GPUs in the modular computing unit to achieve pairwise interconnection of the nine GPUs; during the operation of the modular computing unit, setting eight of the nine GPUs as regular GPUs and setting the remaining one as a redundant GPU; when any one of the eight regular GPUs is detected to have failed, adjusting the remaining seven regular GPUs to achieve pairwise interconnection with the redundant GPU. In the embodiments of this disclosure, by adjusting GPU interface allocation, introducing a configurable optical switching module, and a redundancy management mechanism, the reliability and fault tolerance of the supernode system are improved without significantly increasing hardware costs.

The utility model discloses a modularized computer data encryption external device based on fingerprint identification, which comprises an encryption mobile hard disk, a silica gel protective cover is arranged on the left of the encryption mobile hard disk, a silica gel protective sleeve is sleeved on the surface of the encryption mobile hard disk, and sponge buffer strips are filled at two ends of two sides of the silica gel protective sleeve. The left end of the outer surface of the silica gel sheath is fixedly connected with a hollow silica gel strip. According to the utility model, through the arrangement of the silica gel sheath, good collision buffer protection can be formed around the encrypted mobile hard disk, the influence of collision on internal elements of the encrypted mobile hard disk in the falling process is effectively reduced, and meanwhile, through the arrangement of the hollow silica gel strip, the sponge buffer strip, the silica gel convex block, the sponge buffer block and the sponge buffer strip, the anti-collision performance of the encrypted mobile hard disk is improved. And good collision buffer protection can be formed at the left end, the right end and the two sides of the silica gel sheath respectively, so that the influence of collision on internal elements of the encrypted mobile hard disk in the falling process is further reduced.

The invention discloses a helicopter transmission chain weight estimation method based on modularization, and relates to the field of helicopter transmission chain weight estimation, in particular to a helicopter transmission chain weight estimation method based on modularization. And through modular calculation, an estimation result is quickly generated, and recalculation is not needed in the face of transmission systems of different configurations. The method comprises the following steps: estimating the volume of a single gear in each stage of gear set, and obtaining the weight of the single gear by combining the density of the gears; and selecting the used weight calculation model to obtain the weight of each stage of gear set, and further superposing to obtain the weight of the helicopter transmission chain. Through modular calculation, an estimation result is quickly generated based on weight parameters such as gear types, transmission modes and gear parameters of gears at all levels of the helicopter transmission chain, the design period is shortened, the transmission chain weight calculation process is more systematic, the method can also be used in the subsequent helicopter transmission chain weight optimization process, and the design efficiency is greatly improved.

Modular computing systems can include a plurality of computing blocks, a frame to physically support the computing blocks, and an interconnection infrastructure. The interconnection infrastructure can provide power, cooling, and communications for the computing blocks. Each computing block can include a housing, a computing portion within the housing, a cooling portion within the housing to extract heat from the computing portion, a power infrastructure to power the computing portion, a communications infrastructure to facilitate communications between the computing portion and an external network, a cooling infrastructure to transfer heat from within the housing to outside the housing, and a service corridor within the housing to provide physical access to at least the computing portion.

A computational architecture employing self-pruning fractal branch management for achieving supercomputer-class performance on standard hardware and noisy intermediate-scale quantum (NISQ) devices. Unlike conventional parallel computing systems requiring massive hardware resources or genetic algorithms requiring extensive population evolution, this invention utilizes hierarchical fractal doubles—modular computational units organized in self-similar tree structures—with real-time adaptive pruning eliminating non-promising solution branches based on geometric performance metrics computed via √2-scaled fractal analysis. Controlled perturbations (branch shaking) inject stochastic exploration preventing premature convergence while pruning maintains computational efficiency. The system achieves quantum-competitive performance on classical hardware through fractal interference patterns mimicking quantum superposition, and enables NISQ quantum computers to operate effectively despite hardware noise by pruning decoherence-corrupted branches before they contaminate computation. Core innovation: geometric pruning criterion comparing branch trajectory fractal dimension against optimal threshold, triggering instant elimination of branches exhibiting non-productive exploration patterns. Applications include neural architecture search, protein folding simulation, quantum system modeling, combinatorial optimization, and multi-agent coordination—all achieving 10-100× speedup versus conventional approaches while consuming 60-80% less energy through aggressive branch elimination. Technical advantages: (1) no training dataset required (deterministic pruning), (2) hardware-agnostic (runs on CPU / GPU / QPU), (3) noise-tolerant (quantum error mitigation via pruning), (4) energy-efficient (eliminates wasted computation), (5) scalable (fractal recursion to arbitrary depth).

A modular computing and cooling system is described. For example, an apparatus may comprise a physical interface for a modular computing and cooling system and an electronic cooling cartridge for insertion into the physical interface and removal from the physical interface. The electronic cooling cartridge may comprise an internal electronic component, an internal cooling component for thermal management of the internal electronic component using a cooling fluid, a set of internal connectors to connect the internal electronic component and the internal cooling component to an external electronic component and an external cooling component, respectively, of the modular computing and cooling system, and a closed container encapsulating the internal electronic component, the internal cooling component, and the set of internal connectors. Other embodiments are described and claimed.

The invention provides a GPU redundancy arrangement method and device based on AI server super nodes, and an equipment medium. The GPU redundancy arrangement method based on the AI server super node comprises the steps of obtaining and adjusting an internal interface and an external interface of a GPU in a modular computing unit; performing link path configuration on the 9 GPUs in the modular computing unit to enable the 9 GPUs to realize pairwise interconnection of link paths; when the modular computing unit runs, eight GPUs in the nine GPUs are set as conventional GPUs, and the remaining one GPU in the nine GPUs is set as a redundant GPU; and when any one of the eight GPUs which are set as the conventional GPUs is monitored to be invalid, adjusting the rest seven GPUs in the eight GPUs which are set as the conventional GPUs to realize pairwise interconnection of link paths between the rest seven GPUs and the redundant GPUs. According to the embodiment of the invention, by adjusting GPU interface distribution and introducing a configurable optical switching module and a redundancy management mechanism, the reliability and fault-tolerant capability of the super-node system are improved on the premise that the hardware cost is not greatly increased.

A computing device includes internal components within a modular computing housing assembly that includes an enclosure, front lid, first and second side covers, and mounting arrangement. The enclosure includes connected panels defining a front opening and internal volume. The front lid is removably coupled to the enclosure, covers the front opening, and includes front, first side, and second side portions having side openings that allow computing ports to protrude therethrough. Each side cover is removably coupled to the enclosure and includes an outer face, an inner face, and computing port plugs that plug the computing ports. Removal of a side cover exposes the computing ports to be directly plugged into corresponding computing ports on a separate computing device. The mounting arrangement is located along an enclosure outer surface and includes mounting components that move between positions to lock onto and mount the computing device onto a separate external rail.

The utility model discloses a heat dissipation module, a modular computing unit and an autonomous mobile device, the heat dissipation module comprises a heat conduction structure, the heat conduction structure comprises a heat conduction bottom plate, and the heat conduction bottom plate is provided with a first side surface used for being connected with a target heating element arranged on a circuit board; the cooling fan is connected with the heat conduction structure; the outer shell is used for containing the circuit board, the heat conduction structure and the heat dissipation fan are both arranged in the outer shell, the outer shell comprises an outer shell bottom plate, the outer shell bottom plate is provided with a heat dissipation flow channel structure, the heat dissipation flow channel structure is communicated with the arrangement position of the heat dissipation fan and / or the heat conduction structure and the exterior of the outer shell, and the heat conduction structure is arranged on the outer shell bottom plate and exposed out of the first side face. According to the utility model, the heat conduction structure and the heat dissipation fan are arranged in the outer shell, so that the size occupied by the heat dissipation module can be greatly reduced. And meanwhile, a connecting wire between the heat dissipation fan and the circuit board does not need to be exposed, so that the waterproof problem can be solved, and the cost of secondary waterproof design improvement on the heat dissipation module is reduced.

The present invention relates to a modular computing system (1) forming at least one computer, the system comprising: a motherboard comprising a plurality of PCIe slots and at least one PCIe switch, the PCIe switch being able to route the data communication between the various PCIe slots; a plurality of expansion cards, each expansion card being provided with a PCIe connector and one or more electronic components, the plurality of expansion cards comprising at least one expansion card of a first type, the one or more electronic components of each expansion card of the first type comprising at least one central processing unit and at least one memory, the expansion cards each being plugged into a slot of the respective motherboard, the PCIe switch being configured to define at least one expansion card of the first type as a root complex, RC, to form a computer.

A modular compute platform for artificial-intelligence inference is disclosed. Each compute module delivers exaFLOPS-class throughput within a six-hundred-watt envelope and can be installed on diverse carrier boards such as PCI Express, automotive, robotic, or rackmount systems. Modules include vertically integrated logic and memory for high-bandwidth communication and local storage of neural-network parameters. Uniform mechanical and thermal interfaces allow identical modules to serve multiple markets, enabling wide deployment of exa-scale inference capability.

Modular computing system comprising at least one computer The present invention relates to a modular computing system (1) comprising at least one computer, the system comprising: a motherboard comprising a plurality of PCIe slots and at least one PCIe switch, the PCIe switch being suitable for routing data communication between the different PCIe slots;a plurality of expansion cards, each expansion card having a PCIe connector and one or more electronic components, the plurality of expansion cards comprising at least one expansion card of a first type, the electronic component(s) of each expansion card of the first type comprising at least one central processing unit and at least one memory, the expansion cards each being plugged into a slot of the respective motherboard, the PCIe switch being configured to define at least one expansion card of the first type as the root complex, RC to form a computer. Figure for the abstract: 4;

A modular computing system can include a plurality of computing blocks, a framework for physically supporting the computing blocks, and interconnecting infrastructure. The interconnecting infrastructure can provide the computing blocks with power, cooling, and communications. Each computing block can include an enclosure, a computing section within the enclosure, a cooling section within the enclosure to extract heat from the computing section, power infrastructure to supply power to the computing section, communications infrastructure to facilitate communications between the computing section and an external network, cooling infrastructure to transfer heat from within the enclosure to outside of the enclosure, and a service corridor within the enclosure to provide physical access to at least the computing section.