A kind of preparation technology of zirconia composite abrasive and grinding fluid

Abstract

The invention relates to a preparation process and grinding liquid of a novel zirconia composite abrasive. Firstly, an organic precursor sol of the zirconia composite abrasive is prepared; then the organic precursor sol is granulated; and then sintered to obtain the zirconia composite abrasive. The zirconia composite abrasive prepared by the present invention is formed by bonding countless tiny zirconia particles through the boroaluminate melt at the grain boundary. Although the macroscopic size is large, the zirconia composite abrasive is bonded along the glass during the process of grinding silicon wafers. The interface is broken, and the wear of the abrasive is micro-crushing wear. During the grinding process, it is continuously damaged to produce a large number of new and small grinding edges. The composite abrasive has a high self-sharpening property and a grinding efficiency ratio The alumina abrasive is increased by more than 30%; in addition, the surface of the object to be ground has a large number of small grinding marks, and the surface roughness of the ground workpiece is lower, and it can provide a stable and consistent grinding amount during use, which can effectively take into account Grinding efficiency and surface quality of the ground workpiece.

Description

technical field [0001] The invention relates to a preparation process and a grinding liquid of a zirconia composite abrasive, in particular to a preparation process of a zirconia composite abrasive and a grinding liquid for preparing a grinding liquid for surface processing of a single crystal silicon wafer, and belongs to the field of abrasive preparation. Background technique [0002] At present, the plane finishing of monocrystalline silicon in my country mainly adopts mechanical grinding. The common processing method is to purchase flaky white corundum with a particle size of 7-14 microns as the grinding material, and then mix the abrasive with water (or organic solvent) and dispersant to prepare alumina grinding liquid. The double-end grinding equipment for single crystal silicon wafers adopts a special double-sided vertical grinder. When grinding, there is a cast iron plate on the upper and lower ends of the grinder, and the prepared alumina grinding liquid is added dro...

AI Technical Summary

Problems solved by technology

There is currently a technical bottleneck in this process. With the development of electronic technology, the polished single crystal silicon wafer requires as high a finish as possible and as low a surface residual stress as possible. This requires the use of a finer diameter hard abrasive. However, the finer abrasive will greatly reduce the grinding efficiency, and at the same time, due to the reduction of the grinding ability, the flatness error of the silicon wafer will increase, which is not conducive to high-precision photoetching

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