Semiconductor carrier, semiconductor machining equipment and purging method

Abstract

The invention discloses a semiconductor carrier, semiconductor machining equipment and a purging method. The semiconductor carrier comprises a carrier body; the carrier body is provided with a supporting surface; the supporting surface is used for supporting a work piece; the carrier body is provided with an air inlet; purging holes are formed in the supporting surface; the air inlet communicateswith the purging holes; the air inlet is configured to introduce purging gas; and the purging holes are configured to blow out the purging gas to purge the surface of a pick-and-place device for picking and placing the work piece. With the adoption of the technical scheme above, the problem that the work pieces such as a semiconductor are scrapped, due to the fact that an existing pick-and-place device is possibly contaminated by by-products in the piece picking process and thus contaminates the next work piece to be machined and the contaminated work piece has defects such as polycrystal after the reaction process is completed, is solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor carrier, semiconductor processing equipment and a purging method. Background technique [0002] In the semiconductor manufacturing process, the film to be deposited can be epitaxially formed on the substrate sheet by means of chemical vapor deposition. Before the epitaxial deposition reaction of the sheet, it is necessary to use a pick-and-place device to send the workpiece such as the semiconductor sheet into the reaction chamber, so as to perform the epitaxial deposition reaction on the workpiece. During the epitaxial deposition reaction process, due to the high temperature of the reaction chamber, large amount of gas consumption, and many by-products, after an epitaxial reaction is completed, when the pick-and-place device extends into the reaction part to take the chip, the edge of the pick-and-place device may be contaminated. by-products...

AI Technical Summary

Problems solved by technology

[0003] The invention discloses a semiconductor carrier and semiconductor processing equipment to solve the problem that the current pick-and-place device may be contaminated with by-products during the pick-up process and pollute the next workpiece, resulting in multiple occurrences of the contaminated workpiece after completing the reaction process. Crystal and other defects, resulting in the scrapping of processed parts such as semiconductors

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