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A circuit board soldering high-purity recovery equipment

A technology for recycling equipment and circuit boards, applied in the field of high-purity recycling equipment for circuit board soldering, can solve the problems of low efficiency of tin-soldering separation and recycling, and achieve the effect of high-purity recycling and improving efficiency

Active Publication Date: 2021-02-26
惠州瑞安实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a high-purity recovery equipment for circuit board soldering, which overcomes the problems of low efficiency and difficulty in soldering separation and recovery, improves the efficiency of soldering recovery and reduces the difficulty of recovery

Method used

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  • A circuit board soldering high-purity recovery equipment
  • A circuit board soldering high-purity recovery equipment
  • A circuit board soldering high-purity recovery equipment

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Embodiment Construction

[0018] Combine below Figure 1-4 The present invention is described in detail, wherein, for the convenience of description, the orientations mentioned below are defined as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0019] combined with Figure 1-4 The described high-purity recovery equipment for circuit board soldering includes a fuselage 10, the upper end of the fuselage 10 is provided with a moving cavity 12 with an upward opening, and the lower inner wall of the moving cavity 12 is provided with a cooling cavity with an upward opening 33. The moving chamber 12 is provided with a circuit board clamping mechanism 87 for fixing and taking out the circuit board, and the moving chamber 12 is also provided with a solder separation mechanism 85 for removing the soldering on the circuit board. The cooling cavity 33 is provided with a solder recovery mechanism 86 that will recover the solder on the c...

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Abstract

The invention discloses a circuit board soldering high-purity recovery device, which includes a fuselage, the inner upper end of the fuselage is provided with a moving cavity with an upward opening, and the lower inner wall of the moving cavity is provided with a cooling cavity with an upward opening. The moving chamber is provided with a circuit board clamping mechanism for fixing and taking out the circuit board, the moving chamber is also provided with a soldering separation mechanism for removing the soldering on the circuit board, and the cooling chamber is provided with a circuit board The solder recovery mechanism for recycling the solder on the board. This equipment is suitable for circuit boards of different sizes. It can effectively melt and recycle the solder on the circuit boards of different sizes. The solder can be scraped off while melting, which improves the efficiency of solder drop. The melted solder enters the cooling water to cool, re-solidify and collect on the load-bearing plate. When the collected solder reaches the designed load-bearing weight Finally, the solder can be dehydrated and collected to achieve high-purity recovery of the solder.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board soldering high-purity recovery equipment. Background technique [0002] In the circuit, circuit boards are often used to connect various electronic components and connect some electronic circuits. It is necessary to connect the circuit through soldering on the circuit board. When some discarded circuit boards need to be recycled, the circuit board needs to be Solder on the top into the separation recovery. [0003] At this stage, when recycling the solder on the circuit board, the solder on the circuit board is generally heated manually, so as to realize the separation of the solder to recover the circuit board. This separation method is not only difficult but also efficient. low. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a high-purity recovery equipment for circuit board soldering, which overcome...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22B25/02C22B25/06C22B7/00
CPCC22B7/003C22B25/02C22B25/06Y02P10/20
Inventor 侯光喜
Owner 惠州瑞安实业有限公司
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