Unlock instant, AI-driven research and patent intelligence for your innovation.

Piezoelectric microphone and preparation process thereof

A preparation process and microphone technology, which is applied in the field of microphones, can solve problems such as hindering the movement of the diaphragm, reducing the output voltage of the piezoelectric unit, and reducing the sensitivity of the MEMS microphone, so as to achieve the effects of improving sensitivity and reducing air damping

Inactive Publication Date: 2020-09-15
AAC TECH NANJING
View PDF12 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the piezoelectric MEMS microphone is packaged, the closed air environment hinders the movement of the diaphragm, resulting in a decrease in the output voltage of the piezoelectric unit and a significant decrease in the sensitivity of the MEMS microphone.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Piezoelectric microphone and preparation process thereof
  • Piezoelectric microphone and preparation process thereof
  • Piezoelectric microphone and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0038] see Figure 1 to Figure 2 , a piezoelectric microphone provided in the first embodiment of the present invention, including a substrate 1 with a back cavity 4 and a piezoelectric diaphragm 2 disposed on the substrate 1, the piezoelectric diaphragm 2 includes a The diaphragm layer 21 and the piezoelectric unit 22 fixed on the diaphragm layer 21 . The piezoelectric unit 22 is pressed to drive the diaphragm layer 21 to deform in the space above the back cavity 4, thereby generating a voltage signal.

[0039] In this example, if figure 2 As shown, the piezoelectric microphone also includes a housing 3 covering the diaphragm layer 21. The housing 3 and the diaphragm layer 21 enclose a housing chamber 5 for housing the piezoelectric unit 22. The housing chamber 5 is a vacuum environment. By setting the casing 3 with the cover above the diaphragm layer 21, the casing 3 and the diaphragm layer 21 encircle to form the accommodation cavity 5 for accommodating the piezoelectric...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a piezoelectric microphone and a preparation process thereof. The piezoelectric microphone comprises a substrate with a back cavity and a piezoelectric vibrating diaphragm arranged on the substrate, wherein the piezoelectric vibrating diaphragm comprises a vibrating diaphragm layer fixed on the substrate and a piezoelectric unit fixed on the vibrating diaphragm layer, the piezoelectric microphone further comprises a shell covering the vibrating diaphragm layer, the shell and the vibrating diaphragm layer are encircled to form an accommodating cavity for accommodating thepiezoelectric unit, and the accommodating cavity is a vacuum environment. The output voltage of the piezoelectric unit can be increased, and the sensitivity of the piezoelectric microphone is improved.

Description

【Technical field】 [0001] The invention belongs to the technical field of microphones, in particular to a piezoelectric microphone and a preparation process thereof. 【Background technique】 [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) microphone is a kind of electric energy sound transducer manufactured by micro-machining technology, which has the characteristics of small size, good frequency response characteristics, and low noise. With the development of miniaturization and thinning of electronic devices, MEMS microphones are more and more widely used in these devices. Piezoelectric MEMS microphones have many advantages over traditional capacitive MEMS microphones, including dust and water resistance and higher maximum output sound pressure (AOP). [0003] In the related art, the piezoelectric MEMS microphone diaphragm is composed of multiple diaphragms, and the plurality of diaphragms are fixed on the base with a back cavity through elas...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H04R17/02H04R1/28H04R31/00
CPCH04R17/02H04R1/283H04R31/003H04R2231/003
Inventor 童贝石正雨沈宇李杨
Owner AAC TECH NANJING