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Sensor chip and force sensor device

A sensor chip and a force-applying technology, applied in the direction of measuring devices, microstructure devices, piezoelectric devices/electrostrictive devices, etc., can solve the problems of difficult miniaturization, precision, and productivity of the structure, and achieve improved axis separation , The effect of improving the accuracy of the sensor

Active Publication Date: 2022-04-26
MINEBEA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this force sensor device requires manual work to attach the strain gauges one by one, so there are problems in accuracy and productivity, and it is difficult to miniaturize the structure

Method used

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  • Sensor chip and force sensor device
  • Sensor chip and force sensor device
  • Sensor chip and force sensor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach >

[0053] (Schematic structure of force sensor device 1)

[0054] figure 1 It is a perspective view illustrating the force sensor device of the first embodiment. figure 2 It is a perspective view illustrating the sensor chip and strain body of the force sensor device of the first embodiment. refer to figure 1 and figure 2, the force sensor device 1 has a sensor chip 110 , a strain body 20 and an input / output substrate 30 . The force sensor device 1 is, for example, a multi-axis force sensor device mounted on a wrist, a finger, or the like of a robot used in a machine tool or the like.

[0055] The sensor chip 110 has a function of detecting a predetermined axial displacement at a maximum of 6 axes. The strain body 20 has the function of transmitting the applied force to the sensor chip 110 .

[0056] The sensor chip 110 is bonded to the upper surface side of the strain body 20 so as not to protrude from the strain body 20 . In addition, one end side of the input / output s...

no. 1 example

[0185] Figure 15 It is a diagram (stress contour diagram) showing calculation results of stress when a moment (Mz) in the Z-axis direction is applied to the sensor chip of the reference example by simulation. Marks "+" and "-" are attached to the part where the tensile or compressive stress becomes locally the largest, and it shows that the darker the tone density is toward "+", or the lighter the tone density is toward "-", the stretching or compression The greater the stress. exist Figure 15 In the reference example, with Figure 13 and Figure 14 On the other hand, in the detection beam 113m, a portion where the beam width becomes narrow is not formed between the position connected to the support portion and the position connected to the force point. In the sensor chip of the reference example, when Mz is input, the stress generated increases at the position where the detection beam 113m is connected to the support portion and the position where the detection beam 113...

no. 2 example

[0191] Figure 19 It is a diagram explaining the simulation of other axis components of the sensor chip of the reference example. The sensor chip of the reference example and Figure 15 The shown sensor chip is the same, and a portion where the beam width is narrowed is not formed between the position of the detection beam 113m connected to the support portion and the position connected to the force point. Furthermore, a piezoresistive element for detecting Mz is formed on the detection beam 113m in the vicinity of the position where the detection beam 113m is connected to the support. Figure 19 It is a graph showing the results of calculating the error by simulation. The error is Fx input and Fx when the sensor chip of the reference example is combined with the input of the four axes selected as shown in the column of the input axis at the bottom of the drawing. Output error (N), Fy input and Fy output error (N), Fz input and Fz output error (N). As a sensor chip, the err...

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Abstract

This sensor chip includes: a substrate; a first support part; a second support part around which the first support part is arranged and arranged in the center of the substrate; and a first detection beam connecting the adjacent first support parts to each other a force point that is arranged on the first detection beam and is applied with force; and a plurality of deformation detection elements arranged at predetermined positions of the first detection beam. The plurality of deformation detection elements include a first deformation detection element formed on the first detection beam between the first support portion and the force point, compared to the first detection beam and the first support portion or the first detection beam. The first beam width, which is the width of the first detection beam at the position where the force point is connected, is smaller than the second beam width, which is the width of the first detection beam at the position where the first strain detection element is formed. Further, the first detection beam has a straight portion and an inclined portion connected to the straight portion via a connecting portion, and the plurality of strain detecting elements include a first strain detecting element disposed on the inclined portion side relative to the connecting portion.

Description

technical field [0001] The invention relates to a sensor chip and a force sensor device. Background technique [0002] Conventionally, a force sensor device is known in which a plurality of strain gauges are attached to a strain body made of metal, and detects multiaxial force by converting deformation when an external force is applied into an electric signal. However, this force sensor device requires manual work to attach the strain gauges one by one, so there are problems in accuracy and productivity, and it is difficult to downsize the structure. [0003] On the other hand, a force sensor device has been proposed in which a strain gauge is replaced by a MEMS sensor chip for strain detection, thereby eliminating the problem of bonding accuracy and achieving miniaturization (for example, refer to Patent Document 1). [0004] prior art literature [0005] patent documents [0006] Patent Document 1: Japanese Patent No. 4011345 Contents of the invention [0007] The pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L5/162B81B3/00H01L29/84
CPCH01L29/84B81B3/00G01L5/162G01L5/226
Inventor 山口真也
Owner MINEBEA CO LTD