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Temperature integrated regulation and control device and temperature integrated regulation and control method

A control device and temperature point technology, applied in the field of temperature integrated control devices, can solve problems such as error-prone, time-consuming and labor-intensive, and achieve the effects of fast switching, preventing debugging errors and improving switching efficiency.

Pending Publication Date: 2020-09-18
GREE ELECTRICAL APPLIANCE WUHU +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a temperature integrated control device and a temperature integrated control method, aiming to solve the problem of time-consuming, laborious and error-prone debugging process in the existing mainboard test method, and realize that the test temperature point can be in accordance with the preset requirements It can be fixed and adjustable, which can prevent debugging errors; it is convenient and fast to carry out the effect of debugging and testing

Method used

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  • Temperature integrated regulation and control device and temperature integrated regulation and control method
  • Temperature integrated regulation and control device and temperature integrated regulation and control method
  • Temperature integrated regulation and control device and temperature integrated regulation and control method

Examples

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Effect test

Embodiment 1

[0037] An integrated temperature control device provided in this embodiment includes a temperature point adjustment gear module 2 and a temperature point adjustment circuit module 3 .

[0038] Specifically, such as figure 1 As shown, in the specific implementation, the temperature point adjustment gear module 2 and the temperature point adjustment circuit module are arranged on a housing 1, the housing 1 is a box structure, and the surface of the housing 1 is provided with a temperature point adjustment gear module 2 , The temperature point adjustment circuit module 3 is housed in the housing 1 . The casing 1 can be made of metal materials, or can be made of non-metal materials such as wood and plastic.

[0039]The temperature point adjustment gear module 2 is located on the surface of the housing 1 and includes multiple different gears; for the temperature measurement points corresponding to the different temperatures of different objects to be measured, when the correspondi...

Embodiment 2

[0047] A temperature integrated control device provided in this embodiment has the same structure and principle as that of Embodiment 1, the difference is that the temperature value of the specific temperature point adjustment gear module 2 and the temperature point adjustment circuit module 3 are further defined in detail. specific circuit structure.

[0048] The air-conditioning environment temperature adjustment gear 21 in the present embodiment includes 4 A, B, C, D gears of the first-level air-conditioning environment temperature adjustment gear 21a, and A1, A2, A3 of 16 second-level air-conditioning environment temperature adjustment gears 21b . E1, E2, E3, E4, F1, F2, F3 gears of 7 second-stage air-conditioning tube temperature-regulating gears 22b; T1, T2, T3 gears.

[0049] Specifically, the A1, A2, A3, A4, B1, B2, B3, B4, C1, C2, C3, C4, D1, D2, D3, and D4 gears of the 16 second-level air-conditioning environment temperature adjustment gears 21b correspond to The ...

Embodiment 3

[0060] This embodiment provides an integrated temperature control method. The temperature integrated control method includes:

[0061] S100, configure the overall circuit of the temperature point adjustment circuit module, the overall circuit includes each sub-circuit composed of resistances corresponding to different temperature measurement points of different objects to be measured and their peripheral circuits;

[0062] S200. According to the temperature point that each sub-circuit in the overall circuit needs to output, configure the circuit configuration in the corresponding sub-circuit;

[0063] S300. At the control end corresponding to the resistance regulator, configure a temperature debugging gear corresponding to each sub-circuit;

[0064] For the temperature measurement points corresponding to different temperatures of different objects to be measured, when the corresponding gear is selected, the corresponding sub-circuits in the temperature point adjustment circuit...

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Abstract

The invention provides a temperature integrated regulation and control device and a temperature integrated regulation and control method. The temperature integrated regulation and control device comprises a temperature point regulation circuit module and a temperature point regulation gear module, the temperature point regulation circuit module comprises resistors corresponding to different temperature measuring points of different to-be-measured objects and peripheral circuits of the resistors; the temperature point regulation gear module comprises a plurality of different gears; for the temperature measurement points corresponding to different temperatures of different to-be-measured objects, when a corresponding gear in the temperature point regulation gear module is selected, the corresponding resistor and the peripheral circuit thereof in the temperature point regulation circuit module are used, so that the temperature integrated regulation and control device provides test circuits corresponding to different temperature measuring points of different to-be-measured objects through the same circuit. The problems that according to an existing mainboard testing method, time and labor are wasted in the debugging process, and errors are prone to occurring are solved, the testing temperature points can be fixed and adjusted according to preset requirements, debugging errors can be prevented, and the debugging testing effect can be conveniently and rapidly conducted.

Description

technical field [0001] The invention belongs to the technical field of motherboard testing, and in particular relates to a temperature integrated control device and a temperature integrated control method. Background technique [0002] At present, for the test of the main board of the air conditioner, it is necessary to use 3 resistor trimmers to simulate 15K and 2K thermistors (temperature sensing packages). Before testing each main board, it is necessary to manually connect the corresponding resistor trimmer and the main board. At the same time, during the test of the main board of the mobile phone, for each specified temperature measurement point, the resistance value of the resistor regulator needs to be adjusted according to the temperature value of the required temperature measurement point and the comparison table between the temperature value and the resistance value of the voltage resistor regulator. And during the test of a single motherboard, it is necessary to sw...

Claims

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Application Information

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IPC IPC(8): G01R31/28
CPCG01R31/2874G01R31/2884
Inventor 许勇陶韦赵政许健赵晓博臧必俊
Owner GREE ELECTRICAL APPLIANCE WUHU
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