A kind of processing technology of epoxy board

Abstract

The invention discloses a processing technology of epoxy board, which relates to the technical field of epoxy board. A processing frame is arranged on the outside of the processing frame, and both ends of the outside of the processing frame are installed with heating chambers, a heating plate is arranged inside the heating chamber, and an auxiliary device is installed at one end outside the heating chamber. Through the arrangement of the first limiting device, the limiting groove, the connecting fixing plate, the fixing spring and the first slideway, the present invention can limit the upwardly moving die plate by connecting the fixing plate and the fixing spring, avoiding the need for During the film injection process, the mold shakes, which increases the stability of the injection molding, and enables the mold plate to move horizontally along the direction of the first slide after the injection molding, and the mold plate can be placed in the drying tank by moving. In the inner support plate, drying-type curing treatment is performed.

Description

technical field [0001] The invention relates to the technical field of epoxy boards, in particular to a processing technology of epoxy boards. Background technique [0002] Epoxy board, also known as epoxy glass fiber board, contains active epoxy groups in the molecular structure, so that they can cross-link with various types of curing agents to form insoluble and infusible high With the continuous development of the times, the use of epoxy boards has become more and more extensive, and the processing technology has become more and more perfect. [0003] In the process of epoxy board processing, it is inconvenient to adjust and position the mold, and there are limitations in use, which brings inconvenience to the user. In the process of use, it is inconvenient for the user to move the position of the placed mold, and the production process structure is cumbersome and inconvenient for the user to operate. Therefore, we propose a processing technology of epoxy board. SUMMA...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a processing technology of epoxy board to solve the inconvenience of adjusting and positioning the position of the mold during the processing of the epoxy board proposed in the above background technology, and there are limitations in use, which brings great inconvenience to the user. It is inconvenient to use, and it is not possible to choose a suitable curing method according to the specific use needs during use, and it is inconvenient for the user to move the position of the placed mold during use, and the production process structure is cumbersome, and it is inconvenient for the user to operate The problem

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