Supercharge Your Innovation With Domain-Expert AI Agents!

Application defined multi-tiered wear-leveling for storage class memory systems

A wear leveling and application technology, applied in memory system, memory architecture access/allocation, data processing input/output process, etc., can solve the problem of high wear and tear

Pending Publication Date: 2020-10-16
HUAWEI TECH CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if a cell is repeatedly written and erased, the wear associated with the cell will typically be higher

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Application defined multi-tiered wear-leveling for storage class memory systems
  • Application defined multi-tiered wear-leveling for storage class memory systems
  • Application defined multi-tiered wear-leveling for storage class memory systems

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] It should be understood at the outset that although an illustrative implementation of one or more embodiments is provided below, the disclosed systems and / or methods may be implemented using any number of techniques, whether currently known or in existence. The disclosure should in no way be limited to the illustrative implementations, drawings, and techniques illustrated below, including the exemplary designs and implementations illustrated and described herein, but rather be limited by the scope of the appended claims and their equivalents Modified within the full range of .

[0037] Wear leveling is the process of moving data so that it is stored at different physical addresses in memory at different times to prevent some memory cells from wearing out before others. Typical wear leveling methods are performed on memory in a coarse-grained manner, where thousands of bits change location during one iteration of wear leveling. Typical wear leveling methods also do not ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method implemented by a memory device comprises obtaining, by a processor coupled to a memory, a wear-leveling policy from an application executable at the memory device, wherein the wear-leveling policy indicates a memory size by which to perform wear-leveling within an instance, wherein the instance comprises an address range assigned to the application in the memory of the memory device (703); obtaining, by a processor, a request to access the instance (706); and performing, by the processor, wear-leveling on a plurality of memory cells within the instance according to the wear-leveling policy (709).

Description

[0001] Related Applications Cross Application [0002] This application claims priority to U.S. Patent Application No. 15 / 909,582, filed March 1, 2018, with the U.S. Patent Office, entitled "Application-Defined Multi-Layer Wear Leveling for Storage Class Memory Systems," which The entire contents are incorporated herein by reference. Background technique [0003] The wear or physical location of memory cells in a memory system changes depending on how often each cell is programmed. If a memory cell is programmed once, but never actually reprogrammed, the wear associated with that cell will generally be lower. However, if a cell is repeatedly written and erased, the wear associated with that cell will typically be higher. Since physical addresses are used by the host, if the host repeatedly uses the same address to write and overwrite data, the same physical location or cell in the memory system is repeatedly written and erased. Contents of the invention [0004] According...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F12/00
CPCG06F3/0616G06F3/0647G06F3/064G06F3/0679G06F2212/7211G06F2212/7203G06F12/0238G06F2212/1016G06F2212/1036G06F2212/7201G06F3/0649G06F3/0683G06F12/0246
Inventor 胡潮红
Owner HUAWEI TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More