Circuit board drive-free rolling wheel guide device in circuit board electroplating equipment

Abstract

The invention discloses a circuit board drive-free rolling wheel guide device in circuit board electroplating equipment. The device comprises a rack, a first guide assembly and a second guide assembly. Each of the first guide assembly and the second guide assembly comprises a rolling wheel base fixed block, multiple rolling wheel bases and multiple rolling wheels arranged on the multiple rolling wheel bases and connected rotationally. The device becomes into a drive-free rolling wheel type from an original strip-shaped fixed guide device, each rolling wheel can rotate independently, and no drive mechanism is arranged; when a hanging tool picks a circuit board to pass through the guide device, due to the fact that the influence of flow of electroplating liquid, the circuit board can be in contact with the rolling wheels, the rolling wheels rotate through contact force of the rolling wheels and the circuit boards, the situation that one rolling wheel is continuously in contact with the face of the circuit board through the combination of the multiple stages of rolling wheels, it is guaranteed that the circuit board can be safely plated with a plating layer in the whole electroplatingprocess, and the problems of scratches, board clamping and the like cannot be generated to the circuit board; and the device has the advantages that operation is safe and reliable, the device is simple and convenient to use, and the produce yield is high.

Description

technical field [0001] The invention relates to a guiding device in automatic circuit board production equipment, in particular to a circuit board non-driving roller guiding device in circuit board electroplating equipment. Background technique [0002] Today, with the increasing development of science and technology, the security and safety of products are also used as the main indicators of product development and design. The quality of products is also inspected from these conveniences, especially in the production process of ultra-thin flexible circuit boards. The market demand for flexible circuit boards is increasing, and its thickness is getting thinner and thinner. During the electroplating process, the circuit board and the guide device will touch each other, which will cause scratches on the surface of the circuit board or the circuit board will be stuck in the guide. Therefore, the guiding device of the circuit board in the prior art is not suitable for the produc...

AI Technical Summary

Problems solved by technology

[0002] Today, with the increasing development of science and technology, the security and safety of products are also used as the main indicators of product development and design. The quality of products is also inspected from these conveniences, especially in the production process of ultra-thin flexible circuit boards. The market demand for flexible circuit boards is increasing, and its thickness is getting thinner and thinner. During the electroplating process, the circuit board and the guide device will touch each other, which will cause scratches on the surface of the circuit board or the circuit board will be stuck in the guide. Therefore, the guiding device of the circuit board in the prior art is not suitable for the production operation of the thin flexible circuit board, which has the technical problems of high product scrap rate and low pass rate

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